METHOD FOR FABRICATING BIOCHIPS OR BIOSENSORS USING CD/DVD MAKING COMPATIBLE PROCESSES

• US 20060160249A1
• Filed: 01/17/2005
• Published: 07/20/2006
• Est. Priority Date: 01/17/2005
• Status: Abandoned Application

• Current Assignee: U-Tech Media Corp.
• Original Assignee: U-Tech Media Corp.
• Inventors: Lin, Yen-Heng, Yen, Kuo-Hsiung, Zhang, Shi-Hui, Liao, Chung-Lang, Chen, Irene, Wu, Jo-Wen, Lay, Jyh-Huei, Chou, Tien-Yu
• Application Number:
  US10/905,679
• Publication Number:
  US 20060160249A1
• Time in Patent Office: Days
• US Class Current: 438/1
• CPC Class Codes: G01N 27/3272 Test elements therefor, i.e. disposable laminated substrates with electrodes, reagent and channels optical biosensors G01N33/52

Abstract

A method of manufacturing a plastic biochip or a biosensor test strip, which is compatible with standard CD/DVD making processes. The method includes substrate injection press molding, followed by seamless magnetic biosensor sputtering. If necessary, the sputtered biosensor is cut off from the substrate.

Claims

1. A method compatible to a standard optical disk generation process for manufacturing a electrochemical sensing test strip, the method comprising:

injection press molding a polymer substrate; and

seamless sputtering metal onto the polymer substrate generating microelectrode sensors;

wherein the seamless sputtering includes applying a metal mask having an electrode pattern to a first surface of the polymer substrate and a magnetic material to a second surface of the polymer substrate.

2. The method of claim 1 further comprising removing a chip from the polymer substrate with a stamper having a die with a 33 mm diameter central hole.

3. The method of claim 1 wherein thickness of the polymer substrate is between 0.6 mm and 2.0 mm.

4. The method of claim 1 further comprising performing a cut off process after the seamless sputtering.

5. A method compatible to a standard optical disk generation process for manufacturing a biochip, the method comprising:

providing an insert mold having a pattern;

injection press molding a polymer into the insert mold generating a polymer chip having the pattern of the insert mold; and

seamless sputtering metal onto the polymer chip disposing micro sensing electrodes thereon;

wherein the seamless sputtering includes applying a metal mask having an electrode pattern to a first surface of the polymer chip and a magnetic material to a second surface of the polymer chip.

6. The method of claim 5 wherein the pattern is a channel, a depression, or a hole.

7. The method of claim 5 wherein the chip is a flat rectangular plate having a length and a width between 1 cm and 10 cm.

8. The method of claim 5 further comprising ultra wave melting and fixing the polymer chip after the seamless sputtering.