Method of forming interconnection in semiconductor device
First Claim
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1. A method of forming a multilayer interconnection structure, which comprises the steps of:
- forming a low dielectric constant film on a substrate;
irradiating the low dielectric constant film with UV light, thereby curing it;
laminating a UV blocking film;
laminating a next low dielectric constant film; and
irradiating the next low dielectric constant film with UV light, thereby curing it.
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Abstract
A multilayer interconnection structure is formed by a method comprising the steps of: Forming a low dielectric constant film on a substrate, curing the low dielectric constant film by irradiating it with UV light, laminating a UV blocking film, laminating a next low dielectric constant film, and curing the next low dielectric constant film by irradiating it with UV light.
29 Citations
19 Claims
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1. A method of forming a multilayer interconnection structure, which comprises the steps of:
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forming a low dielectric constant film on a substrate;
irradiating the low dielectric constant film with UV light, thereby curing it;
laminating a UV blocking film;
laminating a next low dielectric constant film; and
irradiating the next low dielectric constant film with UV light, thereby curing it. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of forming a multilayer interconnection structure, which comprises the steps of:
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selecting UV light for curing a low dielectric constant film;
selecting a material which absorbs a wavelength of the UV light;
forming the low dielectric constant film on a substrate;
irradiating the low dielectric constant film with the selected UV light, thereby curing it;
laminating a UV blocking film using the selected material which absorbs a wavelength of the UV light;
laminating a next low dielectric constant film; and
irradiating the next low dielectric constant film with the UV light, thereby curing it. - View Dependent Claims (15, 16, 17)
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18. A method of forming a multilayer interconnection structure, which comprises the steps of:
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forming a first low dielectric constant film having a first film thickness on a substrate;
irradiating the low dielectric constant film with UV light, thereby curing it to change it to a hardened first low dielectric constant film having a second film thickness;
laminating a UV blocking film;
laminating a second low dielectric constant film having a first film thickness;
and irradiating the second low dielectric constant film with UV light, thereby curing it to change it to a hardened second low dielectric constant film having a second film thickness and simultaneously curing the hardened first low dielectric constant to change its thickness to a third film thickness, wherein a rate of change from the second film thickness of the first low dielectric constant film to the third film thickness is approximately 30% or less of a rate of change from the first film thickness to the second film thickness. - View Dependent Claims (19)
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Specification