Multiple digital printing techniques for fabricating printed circuits
First Claim
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1. A method of fabricating a printed circuit comprising:
- depositing a first conductive material to form a first conductive pathway upon a substrate;
depositing a dielectric material directly over at least a first portion of the conductive pathway utilizing an electrophotographic process; and
depositing a second conductive material over at least a portion of the dielectric material to form a second conductive pathway, where the second conductive pathway is in electrical communication with the first conductive pathway.
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Abstract
Methods of fabricating a printed circuit and printed circuits, including a method comprising: (a) depositing a conductive material to form a first conductive pathway upon a substrate; (b) depositing a dielectric material directly over at least a first portion of the conductive pathway utilizing an electrophotographic process; and (c) depositing a conductive material over at least a portion of the dielectric material to form a second conductive pathway, where the second conductive pathway is in electrical communication with the first conductive pathway.
20 Citations
19 Claims
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1. A method of fabricating a printed circuit comprising:
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depositing a first conductive material to form a first conductive pathway upon a substrate;
depositing a dielectric material directly over at least a first portion of the conductive pathway utilizing an electrophotographic process; and
depositing a second conductive material over at least a portion of the dielectric material to form a second conductive pathway, where the second conductive pathway is in electrical communication with the first conductive pathway. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of fabricating a printed circuit comprising:
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depositing a conductive material to form a first conductive pathway upon a substrate;
depositing a dielectric material in contact with at least a first portion of the first conductive pathway; and
depositing a conductive material directly over the dielectric material to form a second conductive pathway in a stacked structure;
wherein the act of depositing a dielectric material in contact with at least a first portion of the first conductive pathway includes the act of vertically electrically insulating the first portion of the conductive pathway from the second conductive pathway. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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19. An RFID antenna, comprising:
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a first conductive material forming a first conductive pathway;
a dielectric material directly contacting a portion of the first conductive pathway and likewise leaving exposed a portion of the first conductive pathway; and
a second conductive material directly in concurrent contact with the first conductive material and the dielectric material, where a majority of the second conductive material is vertically elevated and physically separated from the majority of the first conductive material.
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Specification