VSAT block up converter (BUC) chip
First Claim
Patent Images
1. A Block Up Converter chip comprising:
- a base board formed from a dielectric material and opposing top and bottom metal layers forming a respective top and bottom RF ground, said top metal layer having Radio Frequency (RF) circuits and said bottom metal layer having ground and signal pads;
microwave monolithic integrated circuit (MMIC) chips carried by the base board and operative with said RF circuits and ground and signal pads for receiving and up converting signals; and
a top cover positioned over said base board for protecting said MMIC chips.
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Abstract
A Block Up Converter (BUC) chip includes a base board with opposing top and bottom metal layers and having radio frequency (RF) circuits at the top metal layer and ground and signal pads at the bottom metal layer. Microwave Monolithic Integrated Circuit (MMIC) chips are carried by the base board and operative with the RF circuits and ground and signal pads for receiving and up converting signals. A top cover protects the MMIC chips.
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Citations
26 Claims
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1. A Block Up Converter chip comprising:
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a base board formed from a dielectric material and opposing top and bottom metal layers forming a respective top and bottom RF ground, said top metal layer having Radio Frequency (RF) circuits and said bottom metal layer having ground and signal pads;
microwave monolithic integrated circuit (MMIC) chips carried by the base board and operative with said RF circuits and ground and signal pads for receiving and up converting signals; and
a top cover positioned over said base board for protecting said MMIC chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A Block Up Converter chip comprising:
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a base board formed from a dielectric material and opposing top and bottom metal layers forming respectively a top ground and bottom RF ground, said top metal layer having Radio Frequency (RF) circuits and said bottom metal layer having ground and signal pads, said base board having cut-outs;
a microwave monolithic integrated circuit (MMIC) chip received in each cut-out, said MMIC chips comprising a sub-harmonic mixer MMIC that receives and mixes together an Intermediate Frequency (IF) signal and Local Oscillator (LO) signal and up converts the IF signal into a higher frequency RF signal, a driver amplifier MMIC, and a high power amplifier (HPA) MMIC operatively connected to the sub-harmonic mixer MMIC for amplifying the RF signal;
a surface mounted IF amplifier operatively connected to said sub-harmonic mixer MMIC for amplifying the IF signal into the sub-harmonic mixer MMIC;
filters formed on the base board and operative with the HPA MMIC, driver amplifier MMIC and sub-harmonic mixer MMIC; and
a top cover positioned over said base board for protecting said MMIC chips. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of forming a Block Up Converter chip, which comprises:
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forming Radio Frequency (RF) circuits on a top metal layer of a base board;
forming ground and signal pads on a bottom metal layer;
inserting MMIC chips within cut-outs formed within the base board;
interconnecting the MMIC chips and RF circuits such that received signals can be up converted; and
positioning a top cover over the base board for protecting the MMIC chips. - View Dependent Claims (22, 23, 24, 25, 26)
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Specification