VSAT block up converter (BUC) chip

• US 20060160500A1
• Filed: 01/14/2005
• Published: 07/20/2006
• Est. Priority Date: 01/14/2005
• Status: Abandoned Application

• Current Assignee: Reveal Imaging, LLC
• Original Assignee: Xytrans, Inc.
• Inventors: Ammar, Danny F.
• Application Number:
  US11/036,908
• Publication Number:
  US 20060160500A1
• Time in Patent Office: Days
• US Class Current: 455/118
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1423 Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/16153 Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
• CPC Class Codes: H01L 2924/1617 Cavity coating
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H04B 1/04 : Circuits

Abstract

A Block Up Converter (BUC) chip includes a base board with opposing top and bottom metal layers and having radio frequency (RF) circuits at the top metal layer and ground and signal pads at the bottom metal layer. Microwave Monolithic Integrated Circuit (MMIC) chips are carried by the base board and operative with the RF circuits and ground and signal pads for receiving and up converting signals. A top cover protects the MMIC chips.

Claims

1. A Block Up Converter chip comprising:

a base board formed from a dielectric material and opposing top and bottom metal layers forming a respective top and bottom RF ground, said top metal layer having Radio Frequency (RF) circuits and said bottom metal layer having ground and signal pads;

microwave monolithic integrated circuit (MMIC) chips carried by the base board and operative with said RF circuits and ground and signal pads for receiving and up converting signals; and

a top cover positioned over said base board for protecting said MMIC chips.

2. A Block Up Converter chip according to claim 1, wherein said MMIC chips comprise a sub-harmonic mixer MMIC chip that receives and mixes together an Intermediate Frequency (IF) signal and Local Oscillator (LO) signal and up converts the IF signal into a higher frequency RF signal.

3. A Block Up Converter chip according to claim 2, wherein said MMIC chips comprise a driver amplifier MMIC and a high power amplifier (HPA) MMIC operatively connected to the sub-harmonic mixer MMIC chip for amplifying the RF signal.

4. A Block Up Converter chip according to claim 1, wherein said top cover comprises an inside surface over the MMIC chips and having channelization providing isolation between RF circuits and MMIC chips.

5. A Block Up Converter chip according to claim 4, and further comprising a metallized layer on the inside surface of the top cover and forming a waveguide channel.

6. A Block Up Converter chip according to claim 1, and further comprising vias extending through the base board for connecting the top and bottom RF grounds.

7. A Block Up Converter chip according to claim 1, and further comprising vias extending from the top metal layer to bottom signal pads for carrying input and output signals.

8. A Block Up Converter chip according to claim 1, wherein said bottom metal layer is configured for surface mounting on an RF board.

9. A Block Up Converter chip according to claim 1, and further comprising flanges formed for mounting the base board, said flanges including signal terminals operative with the MMIC chips and RF circuits.

10. A Block Up Converter chip according to claim 1, and further comprising surface mounted by-pass capacitors on the base board, and wire bonds interconnecting by-pass capacitors and MMIC chips to RF circuits.

11. A Block Up Converter chip according to claim 1, and further comprising cut-outs formed within the base board which receive respective MMIC chips, and conductive epoxy securing said MMIC chips within said cut-outs to said bottom metal layer.

12. A Block Up Converter chip comprising:

a base board formed from a dielectric material and opposing top and bottom metal layers forming respectively a top ground and bottom RF ground, said top metal layer having Radio Frequency (RF) circuits and said bottom metal layer having ground and signal pads, said base board having cut-outs;

a microwave monolithic integrated circuit (MMIC) chip received in each cut-out, said MMIC chips comprising a sub-harmonic mixer MMIC that receives and mixes together an Intermediate Frequency (IF) signal and Local Oscillator (LO) signal and up converts the IF signal into a higher frequency RF signal, a driver amplifier MMIC, and a high power amplifier (HPA) MMIC operatively connected to the sub-harmonic mixer MMIC for amplifying the RF signal;

a surface mounted IF amplifier operatively connected to said sub-harmonic mixer MMIC for amplifying the IF signal into the sub-harmonic mixer MMIC;

filters formed on the base board and operative with the HPA MMIC, driver amplifier MMIC and sub-harmonic mixer MMIC; and

a top cover positioned over said base board for protecting said MMIC chips.

13. A Block Up Converter chip according to claim 12, wherein said top cover comprises an inside surface over the MMIC chips and having channelization providing isolation between RF circuits and MMIC chips.

14. A Block Up Converter chip according to claim 13, and further comprising a metallized layer on the inside surface of the top cover and forming a waveguide channel.

15. A Block Up Converter chip according to claim 12, and further comprising vias extending through the base board for connecting the top ground and bottom RF ground.

16. A Block Up Converter chip according to claim 12, and further comprising vias extending from the top metal layer to bottom signal pads for carrying input and output signals.

17. A Block Up Converter chip according to claim 12, wherein said bottom metal layer is configured for surface mounting on an RF board.

18. A Block Up Converter chip according to claim 12, and further comprising flanges formed for mounting the base board, said flanges including signal terminals operative with the MMIC chips and RF circuits.

19. A Block Up Converter chip according to claim 12, and further comprising surface mounted by-pass capacitors and wire bonds interconnecting by-pass capacitors and MMIC chips to RF circuits.

20. A Block Up Converter chip according to claim 12, and further comprising conductive epoxy securing said MMIC chips within said cut-outs to said bottom metal layer.

21. A method of forming a Block Up Converter chip, which comprises:

forming Radio Frequency (RF) circuits on a top metal layer of a base board;

forming ground and signal pads on a bottom metal layer;

inserting MMIC chips within cut-outs formed within the base board;

interconnecting the MMIC chips and RF circuits such that received signals can be up converted; and

positioning a top cover over the base board for protecting the MMIC chips.

22. A method according to claim 21, which further comprises forming vias that extend through the base board for connecting the top metal layer as a top ground and bottom metal layer as an RF ground.

23. A method according to claim 21, which further comprises forming vias that interconnect signal pads and RF circuits.

24. A method according to claim 21, wherein the MMIC chips comprise a sub-harmonic mixer MMIC chip that receives and mixes together an Intermediate Frequency (IF) signal and Local Oscillator (LO) signal and up converts the IF signal into a higher frequency RF signal, a driver amplifier MMIC, and a high power amplifier (HPA) MMIC operatively connected to the sub-harmonic mixer MMIC for amplifying the RF signal.

25. A method according to claim 24, which further comprises surface mounting an IF amplifier on the base board and operatively connecting the IF amplifier to the sub-harmonic mixer MMIC for amplifying the IF signal into the sub-harmonic mixer MMIC.

26. A method according to claim 21, which further comprises etching filters on the top metal surface of the base board.