System-in-package wireless communication device comprising prepackaged power amplifier

• US 20060160504A1
• Filed: 06/14/2005
• Published: 07/20/2006
• Est. Priority Date: 01/19/2005
• Status: Active Grant

• Current Assignee: Micro Mobio Corporation
• Original Assignee: Micro Mobio Corporation
• Inventors: Ichitsubo, Ikuroh, Liu, Wen Chung, Kubota, Kanya
• Granted Patent: US 7,769,355 B2
• Time in Patent Office: Days
• US Class Current: 455/127.100
• CPC Class Codes: H01L 2223/665 Bias feed arrangements
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01031 : Gallium [Ga]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/04953 : TaN
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/10336 : Aluminium gallium arsenide [AlGaAs]
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19103 : interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H03F 1/0272 : by using a signal derived from the output signal
• CPC Class Codes: H03F 1/34 : Negative-feedback-circuit arrangements with or without positive feedback H03F1/02 - H03F1/30, H03F1/38 - H03F1/50, H03F3/50 take precedence ; for rejection of common mode signals H03F3/45479
• CPC Class Codes: H03F 2200/294 : the amplifier being a low noise amplifier [LNA]
• CPC Class Codes: H03F 2200/372 : Noise reduction and elimination in amplifier
• CPC Class Codes: H03F 3/195 : in integrated circuits
• CPC Class Codes: H03F 3/24 : of transmitter output stages
• CPC Class Codes: H03G 3/3042 : in modulators, frequency-changers, transmitters or power amplifiers transmission power control in bidirectional transmission systems H04W52/04
• CPC Class Codes: H04B 2001/0433 : with linearisation using feedback
• CPC Class Codes: H05K 1/0237 : High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/144 : Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/16 : incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2201/041 : Stacked PCBs, i.e. having neither an empty space nor mounted components in between
• CPC Class Codes: H05K 3/341 : Surface mounted components
• CPC Class Codes: H05K 3/3442 : having edge contacts, e.g. leadless chip capacitors, chip carriers

Abstract

A substantially rectangular shaped power amplifier module includes a power amplifier for amplifying radio frequency signals, a bias control terminal and a power sensing terminal disposed on the same side of the power amplifier module, an input terminal and a ground terminal disposed on the same side of the power amplifier module, and an output terminal and one or more power supply terminals disposed on the same side of the power amplifier module.

Claims

1. A substantially rectangular shaped power amplifier module, comprising:

a power amplifier configured to receive an input radio frequency signal to produce an amplified radio frequency signal in response to a bias control signal;

a bias control terminal configured to receive the bias control signal;

a power sensing terminal configured to output a power sensing signal in response to the amplified radio frequency signal, wherein the bias control terminal and the power sensing terminal are disposed on the same side of the substantially rectangular shaped power amplifier module;

an input terminal configured to receive the input radio frequency signal;

a ground terminal electrically connected to the ground of the power amplifier, wherein the input terminal and the ground terminal are disposed on the same side of the substantially rectangular shaped power amplifier module;

an output terminal configured to output the amplified radio frequency signal; and

one or more power supply terminal configured to receive power to be supplied to the power amplifier, wherein the output terminal and the one or more power supply terminals are disposed on the same side of the substantially rectangular shaped power amplifier module.

2. The substantially rectangular shaped power amplifier module of claim 1, wherein three sides comprise nine electric terminals including one ground terminal and fourth side does not comprise any electric terminal.

3. The substantially rectangular shaped power amplifier module of claim 1, further comprising two power supply terminals disposed on the same side as the output terminal of the substantially rectangular shaped power amplifier module to receive power to be supplied to the power amplifier.

4. The substantially rectangular shaped power amplifier module of claim 1, further comprising a not-connected terminal disposed on the same side as the input terminal and the ground terminal of the substantially rectangular shaped power amplifier module.

5. The substantially rectangular shaped power amplifier module of claim 1, further comprising a first side approximately 2.4 mm in width and a second side approximately 3.0 mm in length.

6. The substantially rectangular shaped power amplifier module of claim 1, wherein at least one of the input terminal, the output terminal, the ground terminal, the power sensing terminal, and the power control terminal has dimensions of approximately 0.33 mm by 0.4 mm.

7. The substantially rectangular shaped power amplifier module of claim 1, further comprising a central ground pad that has dimensions of approximately 1.7 mm by 1.7 mm.

8. The substantially rectangular shaped power amplifier module of claim 1, wherein the input impedance for the input radio frequency signal is 50 ohm.

9. The substantially rectangular shaped power amplifier module of claim 1, further comprising:

a bias control circuit configured to receive the bias control signal at the bias control terminal to control the biasing voltage or the biasing current of the power amplifier; and

a power sensing circuit configured to detect the amplified radio frequency signal to produce the power sensing signal at the power sensing terminal.

10. A wireless communication device, comprising:

a transceiver configured to convert an input electric signal to a radio frequency signal, and

a prepackaged power amplifier configured to produce an amplified radio frequency signal in response to the radio frequency signal;

wherein the prepackaged power amplifier has been tested to be capable of amplifying radio-frequency signals before the prepackaged power amplifier is electrically connected with the transceiver.

11. The wireless communication device of claim 10, wherein the prepackaged power amplifier comprises an impedance matching circuit to receive the input radio frequency signal.

12. The wireless communication device of claim 10, wherein the prepackaged power amplifier comprises one or more electric terminals that are configured to receive power supply, to receive a bias-control signal, or to output a power-sensing signal.

13. The wireless communication device of claim 12, further comprising a digital control unit configured to produce the bias control signal to be received by the prepackaged power amplifier.

14. The wireless communication device of claim 13, wherein the digital control unit is a base band processor.

15. The wireless communication device of claim 12, further comprising a substrate configured to electrically connect to the one or more electric terminals in the prepackaged power amplifier to permit the prepackaged power amplifier to be electrically connected to the transceiver.

16. The wireless communication device of claim 15, wherein the substrate includes one or more of a printed circuit board (PCB), a lead frame, and lower-temperature co-fired ceramics (LTCC).

17. The wireless communication device of claim 10, further comprising:

a base band processor configured to provide the input electric signal to the transceiver; and

an antenna configured to produce a wireless signal in response to the amplified radio frequency signal.

18. The wireless communication device of claim 10, further comprising a window that exposes the prepackaged power amplifier to the ambient environment.

19. A wireless communication device, comprising:

a base-band processor configured to digitally process an input electric signal to produce a processed electric signal;

a transceiver configured to convert the processed electric signal to a radio frequency signal;

a prepackaged power amplifier configured to receive the radio frequency signal to produce an amplified radio frequency signal, wherein the prepackaged power amplifier comprises an impedance matching circuit to receive the radio frequency signal and one or more electric terminals to receive power supply, to receive a bias-control signal, or to output a power-sensing signal;

an antenna configured to produce a wireless signal in response to the amplified radio frequency signal; and

a substrate configured to electrically connect to the one or more electric terminals in the prepackaged power amplifier to permit the prepackaged power amplifier to be electrically connected to the antenna, the transceiver, and the base band processor,

wherein the prepackaged power amplifier has been tested to be capable of amplifying radio-frequency signals before the prepackaged power amplifier is electrically connected with the substrate.

20. The wireless communication device of claim 19, wherein the substrate includes one or more of a printed circuit board (PCB), a lead frame, and lower-temperature co-fired ceramics (LTCC).