Method for manufacturing semiconductor device

• US 20060161288A1
• Filed: 12/19/2005
• Published: 07/20/2006
• Est. Priority Date: 01/18/2005
• Status: Active Grant

• Current Assignee: Panasonic Semiconductor Solutions Co., Ltd. (Winbond Electronics Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Imai, Shinichi
• Granted Patent: US 7,324,866 B2
• Time in Patent Office: Days
• US Class Current: 700/121
• CPC Class Codes: G05B 19/41835 characterised by programme execution
• CPC Class Codes: G05B 2219/32057 Control cell as function of correlation between stored and detected machine state
• CPC Class Codes: G05B 2219/32058 Execute program as function of deviation from predicted state, result
• CPC Class Codes: G05B 2219/32096 Batch, recipe configuration for flexible batch control
• CPC Class Codes: G05B 2219/32135 APC advanced process control applications
• CPC Class Codes: G05B 2219/32198 Feedforward inspection data for calibration, manufacturing next stage
• CPC Class Codes: G05B 2219/37224 Inspect wafer
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A method for manufacturing a semiconductor device is provided in which it is possible to perform process control taking account of wafer information and to deal with the process control in which a recipe is change from one wafer to another. The method comprises steps of inserting a process control system into the path of a network where a manufacturing execution system (MES) and a manufacturing apparatus are connected with each other by using a LAN, obtaining a process result on the lot of the wafers at a previous step through the use of the process control system to rewrite the process recipe, and transmitting the rewritten process recipe from the process control system to the manufacturing apparatus. Since the method includes the step of obtaining the process result on the lot effected at the previous step as wafer information, it is possible to calculate a control parameter taking account of the state of the wafers. Also, since a process control (APC) system is inserted between the MES and the apparatus, there is no communication between the MES and the APC system, so that a communication burden is reduced, thereby the process control can be performed from one wafer to another.

Claims

1. A method for manufacturing a semiconductor device, wherein a process recipe is transmitted from a manufacturing execution system to a manufacturing apparatus and a lot of the semiconductor devices is processed, the method comprising steps of:

inserting a process control system into the path of a network where the manufacturing execution system and the manufacturing apparatus are connected with each other by using a LAN;

obtaining a process result on the lot effected at a previous step through the use of the process control system to rewrite the process recipe base on the process result; and

transmitting the rewritten process recipe from the process control system to the manufacturing apparatus.

2. The method for manufacturing a semiconductor device according to claim 1, the method including a step of checking the state of the manufacturing apparatus at the process control system, wherein the process recipe can be rewritten when the state of the manufacturing apparatus has been judged to be normal.

3. The method for manufacturing a semiconductor device according to claim 1 comprising steps of:

calculating a control parameter value at the process control system in advance based on the process result on the lot effected at the previous step; and

rewriting the process recipe through the use of the control parameter value.

4. The method for manufacturing a semiconductor device according to claim 2 comprising steps of:

calculating a control parameter value at the process control system in advance based on the process result on the lot effected at the previous step; and

rewriting the process recipe through the use of the control parameter value.

5. The method for manufacturing a semiconductor device according to claim 3 comprising steps of:

transmitting data from an inspection apparatus, which inspects the lot processed at the previous step, to the process control system; and

calculating a control parameter value based on the data in advance at the process control system.

6. The method for manufacturing a semiconductor device according to claim 4 comprising steps of:

transmitting data from an inspection apparatus, which inspects the lot processed at the previous step, to the process control system ; and

calculating a control parameter value based on the data in advance at the process control system.

7. The method for manufacturing a semiconductor device according to claim 3 comprising steps of:

storing the process recipe rewritten by using the control parameter value;

obtaining an inspection result on the processed lot; and

updating the control parameter value from the inspection result.

8. The method for manufacturing a semiconductor device according to claim 4 comprising steps of:

storing the process recipe rewritten by using the control parameter value;

obtaining an inspection result-on the processed lot; and

updating the control parameter value from the inspection result.

9. The method for manufacturing a semiconductor device according to claim 5 comprising steps of:

storing the process recipe rewritten by using the control parameter value;

obtaining an inspection result on the processed lot; and

updating the control parameter value from the inspection result.

10. The method for manufacturing a semiconductor device according to claim 6 comprising steps of:

storing the process recipe rewritten by using the control parameter value;

obtaining an inspection result on the processed lot; and

updating the control parameter value from the inspection result.