Method and apparatus to assist with removing an adhesive system

• US 20060162855A1
• Filed: 01/18/2006
• Published: 07/27/2006
• Est. Priority Date: 10/18/2002
• Status: Active Grant

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Sullivan, Stacey A., Hopper, Glenn A., Rorabaugh, Michael E., Dabelstein, Donald K.
• Granted Patent: US 9,511,536 B2
• Time in Patent Office: Days
• US Class Current: 156/247
• CPC Class Codes: B29C 63/0013 Removing old coatings
• CPC Class Codes: C09J 11/00 Features of adhesives not provided for in group C09J9/00, e.g. additives
• CPC Class Codes: C09J 2301/412 presence of microspheres
• CPC Class Codes: C09J 5/06 involving heating of the applied adhesive
• CPC Class Codes: Y10T 156/16 Surface bonding means and/or assembly means with bond interfering means [slip sheet, etc. ]

Abstract

Disclosed is an adhesive system that allows for a strong adhesion of a member to a surface, while also allowing for easy removal of the member after a prolonged period of attachment. A releasing agent can be included in an adhesive layer of the adhesive system. A heating system, such as an induction heating system, can be used to heat the releasing agent to activate it to assist in removing the adhesive system.

Claims

1. A method of removing an appliqué

from a substrate, comprising;

applying an adhesive layer to a substrate;

applying an appliqué

to the adhesive layer;

providing a releasing agent in the applied adhesive layer; and

activating the releasing agent provided in the adhesive layer to substantially destroy the bond formed by the adhesive layer between the applied appliqué and

the substrate.

2. The method of claim 1, wherein activating the releasing agent includes heating at least one of the releasing agent, the substrate, the adhesive layer, or combinations thereof.

3. The method of claim 1, wherein heating includes providing an induction coil to induce a field in at least one of the adhesive layer, the releasing agent, the substrate or combinations thereof.

4. The method of claim 3, wherein the induction coil is powered with a power source having a frequency of about 5 kilohertz to about 100 megahertz.

5. The method of claim 1, wherein the adhesive layer is first applied to the substrate and then the appliqué

is applied to the adhesive layer.

6. The method of claim 1, wherein providing the releasing agent includes providing a capsule including a gas that is expandable at a selected temperature.

7. The method of claim 1, wherein providing the releasing agent includes providing a capsule including a material that assists in destroying the adhesive layer and activating the releasing agent includes heating the capsule to allow the releasing material to escape.

8. The method of claim 1, further comprising:

removing the appliqué and

the adhesive layer.

9. The method of claim 8, further comprising:

removing thermal energy from the substrate by removing the heating source, removing the adhesive layer, removing the appliqué

, or combinations thereof.

17. The method of claim 1, further comprising:

removing the appliqué and

the adhesive layer.

18. The method of claim 17, further comprising:

removing thermal energy from the substrate by removing the heating source, removing the adhesive layer, removing the appliqué

, or combinations thereof.

10. A method of removing an appliqué

comprising;

providing an aircraft;

applying an adhesive layer to an outer surface of the aircraft so that the outer surface becomes a substrate;

applying an appliqué

to the adhesive layer;

providing a releasing agent with the adhesive layer;

activating the releasing agent with an induction member, wherein the induction member induces a field that produces thermal energy to activate the releasing agent; and

reducing the adhering power of the adhesive layer.

11. The method of claim 10, wherein activating the releasing agent includes heating at least one of the releasing agent, the substrate, the adhesive layer, or combinations thereof.

12. The method of claim 10, wherein heating includes providing an induction coil to induce a field in at least one of the adhesive layer, the releasing agent, the substrate or combinations thereof.

13. The method of claim 12, wherein the induction member includes a coil that is powered with a power source having a frequency of about 5 hertz to about 200 megahertz.

14. The method of claim 10, wherein the adhesive layer is first applied to the substrate and then the appliqué

is applied to the adhesive layer.

15. The method of claim 10, wherein providing the releasing agent includes providing a capsule including a gas that is expandable at a selected temperature.

16. The method of claim 10, wherein providing the releasing agent includes providing a capsule including a material that assists in destroying the adhesive layer and activating the releasing agent includes heating the capsule to allow the releasing material to escape.

19. A system to remove an appliqué

comprising;

an aircraft substrate;

an adhesive placed between an appliqué and

a substrate to substantially form a bond between the appliqué and

the substrate;

a releasing agent dispersed in the adhesive;

an induction heating system operable to produce thermal energy in at least one of the substrate, the appliqué

, the releasing agent, or combinations thereof;

wherein the releasing agent is selectively activated with the induction heating system to substantially eliminate the bond between the appliqué and

the substrate to thereby enable ready removal of the appliqué

from the substrate.

20. The system of claim 19, wherein the releasing agent includes a capsule containing a volume of gas;

and

wherein the capsule is selectively activated to cause the volume of gas to expand the capsule, thereby weakening the bond between the component and the substrate.

21. The system of claim 19, wherein the adhesive agent substantially permanently affixes the component to the substrate.

22. The system of claim 19, wherein the releasing agent includes a constituent able to evolve a gas when activated, such that the gas expands to weaken the bond between the component and the substrate.

23. The system of claim 19, wherein the releasing agent includes a constituent selectively activated to change between a neutral form and an activated form, such that the activated form dissolves the adhesive agent.

24. The system of claim 19, further comprising:

an edge sealant adapted to be placed on the exterior of the component;

an edge sealant releasing agent dispersed in the edge sealant;

wherein the component includes an exterior and the edge sealant is placed on the exterior of the component to assist in the bond between an edge of the component and the substrate.