Method for preparing ball grid array substrates via use of a laser
First Claim
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1. A semiconductor device formed by a laser etching process on a substrate having a surface comprising:
- forming resist on at least a portion of the surface; and
etching the resist from the at least a portion of the surface of the substrate using a laser.
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Abstract
A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.
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18 Claims
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1. A semiconductor device formed by a laser etching process on a substrate having a surface comprising:
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forming resist on at least a portion of the surface; and
etching the resist from the at least a portion of the surface of the substrate using a laser. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A device formed by a laser etching process on a substrate having a surface comprising:
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forming resist on at least a portion of the surface; and
etching the resist from the at least a portion of the surface of the substrate using a laser. - View Dependent Claims (8, 9, 10, 11, 12)
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13. An apparatus formed by a laser etching process on a substrate having a surface comprising:
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forming resist on at least a portion of the surface; and
etching the resist from the at least a portion of the surface of the substrate using a laser. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification