Packaging designs for LEDs

• US 20060163590A1
• Filed: 08/23/2005
• Published: 07/27/2006
• Est. Priority Date: 01/21/2005
• Status: Active Grant

• Current Assignee: Luminus Devices Incorporated (Sanan Optoelectronics Company Limited)
• Original Assignee: Luminus Devices Incorporated (Sanan Optoelectronics Company Limited)
• Inventors: Panaccione, Paul, Karlicek, Robert F. Jr., Lim, Michael, Erchak, Alexei A., Lidorikis, Elefterios, Venezia, Jo A., Hoepfner, Christian
• Granted Patent: US 7,692,207 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01032 Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01051 Antimony [Sb]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 33/385 the electrode extending at least partially onto a side surface of the semiconductor body
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Light-emitting devices, and related components, processes, systems and methods are disclosed.

Claims

1. A system comprising:

a light emitting device comprising a multi-layer stack of materials including a light generating region, the light emitting device having a surface; and

a package containing the multi-layer stack of materials, the package having a layer configured so that at least about 75% of the light that that emerges from the light emitting device and impinges on the layer passes through the layer, the layer being disposed such that a distance between the surface of the light emitting device and a surface of the layer nearest to the surface of the light emitting device is from about five microns to about 400 microns.

2. The system of claim 1, wherein multi-layer stack of materials further comprises a first layer supported by the light generating region, a surface of the first layer being configured so that light generated by the light generating region can emerge from the light emitting device via a surface of the first layer.

3. The system of claim 2, wherein the surface of the first layer has a dielectric function that varies spatially according to a pattern, and the pattern has an ideal lattice constant and a detuning parameter with a value greater than zero.

4. The system of claim 2, wherein the surface of the first layer has a dielectric function that varies spatially according to a nonperiodic pattern.

5. The system of claim 2, wherein the surface of the first layer has a dielectric function that varies spatially according to a quasicrystalline pattern.

6. The system of claim 2, wherein the surface of the first layer has a dielectric function that varies spatially according to a complex periodic pattern.

7. The system of claim 2, wherein the surface of the first layer has a dielectric function that varies spatially according to a periodic pattern.

8. The system of claim 1, wherein the light emitting device has an edge that is at least about one millimeter long.

9. The system of claim 1, wherein the light emitting device has an edge that is at least about 1.5 millimeters.

10. The system of claim 1, wherein the layer further comprises at least one optical component.

11. The system of claim 10, wherein the optical component is an optical component selected from the group consisting of a photonic lattice, a color filter, a polarization selective layer, a wavelength conversion layer, and an anti-reflective coating.

12. The system of claim 1, wherein an aspect ratio of the surface of the light emitting device is about 4×

3.

13. The system of claim 1, wherein an aspect ratio of the surface of the light emitting device is about 16×

9.

14. The system of claim 1, wherein an aspect ratio of the surface of the light emitting device is 4×

3.

15. The system of claim 1, wherein an aspect ratio of the surface of the light emitting device is 16×

9.

16. The system of claim 1, wherein the package further includes a heat sink layer.

17. The system of claim 1, wherein the package is mounted on a heat sink device.

18. The system of claim 1, wherein the package includes a package substrate.

19. The system of claim 18, wherein the package substrate contains Al, N, Cu, C, Au or combinations thereof.

20. The system of claim 1, wherein the package is mounted on a thermoelectric cooler.

21. The system of claim 1, wherein the light emitting device is a light emitting diode.

22. The system of claim 21, wherein the light emitting diode is a photonic lattice light emitting diode.

23. The system of claim 1, wherein the light emitting device is a surface emitting laser.

24. The system of claim 1, wherein the light emitting device is selected from the group consisting of light emitting diodes, lasers, optical amplifiers, and combinations thereof.

25. The display system of claim 1, wherein the light emitting device is selected from the group consisting of OLEDs, flat surface-emitting LEDs, HBLEDs, and combinations thereof.

26. The system of claim 1, further comprising a cooling system configured so that, during use, the cooling system regulates a temperature of the light emitting diode.

27. The system of claim 1, wherein the distance between the surface of the light emitting device and the surface of the layer nearest to the surface of the light emitting device is from about five microns to about 300 microns.

28. The system of claim 1, wherein the distance between the surface of the light emitting device and the surface of the layer nearest to the surface of the light emitting device is from about five microns to about 200 microns.

29. The system of claim 1, wherein the distance between the surface of the light emitting device and the surface of the layer nearest to the surface of the light emitting device is from about five microns to about 100 microns.

30. The system of claim 1, wherein the distance between the surface of the light emitting device and the surface of the layer nearest to the surface of the light emitting device is from about 50 microns to about 100 microns.

31. A system comprising:

a light emitting device comprising a multi-layer stack of materials including a light generating region, the light emitting device having a surface and an edge; and

a package containing the multi-layer stack of materials, the package comprising a layer configured so that at least about 75% of the light that that emerges from the light emitting device and impinges on the layer passes through the layer, the layer being positioned such that a ratio of the length of the edge to a distance between the surface of the light emitting device and a surface of the layer nearest to the surface of the light emitting device is at least about 10.

32. The system of claim 31, wherein the multi-layer stack of materials further comprises a first layer supported by the light generating region, a surface of the first layer being configured so that light generated by the light generating region can emerge from the light emitting device via a surface of the first layer.

33. The system of claim 32, wherein the surface of the first layer has a dielectric function that varies spatially according to a pattern, and the pattern has an ideal lattice constant and a detuning parameter with a value greater than zero.

34. The system of claim 32, wherein the surface of the first layer has a dielectric function that varies spatially according to a nonperiodic pattern.

35. The system of claim 32, wherein the surface of the first layer has a dielectric function that varies spatially according to a quasicrystalline pattern.

36. The system of claim 32, wherein the surface of the first layer has a dielectric function that varies spatially according to a complex periodic pattern.

37. The system of claim 32, wherein the surface of the first layer has a dielectric function that varies spatially according to a periodic pattern.

38. The system of claim 31, wherein the light emitting device has an edge that is at least about one millimeter long.

39. The system of claim 31, wherein the light emitting device has an edge that is at least about 1.5 millimeters.

40. The system of claim 31, wherein the layer further comprises at least one optical component.

41. The system of claim 40, wherein the optical component is an optical component selected from the group consisting of a photonic lattice, a color filter, a polarization selective layer, a phosphor layer, an anti-reflective coating.

42. The system of claim 31, wherein an aspect ratio of the surface of the light emitting device is about 4×

3.

43. The system of claim 31, wherein an aspect ratio of the surface of the light emitting device is about 16×

9.

44. The system of claim 31, wherein an aspect ratio of the layer of the light emitting device is 4×

3.

45. The system of claim 31, wherein an aspect ratio of the layer of the light emitting device is 16×

9.

46. The system of claim 31, wherein the package further includes a heat sink layer.

47. The system of claim 31, wherein the package is mounted on a heat sink device.

48. The system of claim 31, wherein the package includes a package substrate.

49. The system of claim 48, wherein the package substrate contains of Al, N, Cu, C, Au or combinations thereof.

50. The system of claim 31, wherein the package is mounted on a thermoelectric cooler.

51. The system of claim 31, wherein the light emitting device is a light emitting diode.

52. The system of claim 51, wherein the light emitting diode is a photonic lattice light emitting diode.

53. The system of claim 31, wherein the light emitting device is a surface emitting laser.

54. The system of claim 31, wherein the light emitting device is selected from the group consisting of light emitting diodes, lasers, optical amplifiers, and combinations thereof.

55. The display system of claim 31, wherein the light emitting device is selected from the group consisting of OLEDs, flat surface-emitting LEDs, HBLEDs, and combinations thereof.

56. The system of claim 31, further comprising a cooling system configured so that, during use, the cooling system regulates a temperature of the light emitting diode.

57. The system of claim 31, wherein the ratio of the length of the edge to the distance between the surface of the light emitting device and the surface of the layer nearest to the surface of the light emitting device is at least about 20.

58. The system of claim 31, wherein the ratio of the length of the edge to the distance between the surface of the light emitting device and the surface of the layer nearest to the surface of the light emitting device is at least about 50.

59. A system comprising:

an LED having a surface, the LED being capable of radiating light at a wavelength; and

a layer positioned from about five microns to about 400 microns from the surface of the LED, the layer being configured so that at least about 75% of the light that that emerges from the light emitting device and impinges on the layer passes through the layer.

60. A system comprising:

an LED having an edge, the LED being capable of radiating light at a wavelength; and

a layer positioned at a distance from the surface of the LED, the distance being at most about 10% of the length of the edge, the layer being configured so that at least about 75% of the light that that emerges from the light emitting device and impinges on the layer passes through the layer.