LIGHT EMITTING DIODE LAMP MODULE

• US 20060163598A1
• Filed: 01/25/2005
• Published: 07/27/2006
• Est. Priority Date: 01/25/2005
• Status: Active Grant

• Current Assignee: Grand Motomo Lights Co., Ltd.
• Original Assignee: Grand Motomo Lights Co., Ltd.
• Inventors: Lin, Hung-Chih
• Granted Patent: US 7,217,005 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: F21S 4/10 with light sources attached to loose electric cables, e.g. Christmas tree lights
• CPC Class Codes: F21W 2121/00 Use or application of lighting devices or systems for decorative purposes, not provided for in codes F21W2102/00 – F21W2107/00
• CPC Class Codes: F21Y 2113/17 forming a single encapsulated light source
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

An LED lamps module is provided. The LED lamp module includes a plurality of LED lamps, a plurality of electric wires and a plurality of moisture-resisting members. In one embodiment of the present invention, each LED lamp includes a substrate with a circuitry, at least one LED chip disposed on the substrate and connected with the circuitry electrically, a plurality of pins connected with the circuitry of the substrate electrically, and an encapsulant encapsulating the substrate, the LED chip and a portion of each pin. The electric wires are connected with the pins exposed. The moisture-resisting members encapsulats the pins exposed and a portion of each electric wire.

Claims

1. An light emitting diode (LED) lamp module, comprising:

a plurality of LED lamps, wherein each LED lamp comprising;

a substrate with a circuitry;

at least one LED chip disposed on the substrate and connected with the circuitry electrically;

a plurality of pins connected with the circuitry of the substrate electrically;

an encapsulant encapsulating the substrate, the LED chip and a portion of each pin;

a plurality of electric wires connected with the pins exposed; and

a plurality of moisture-resisting members encapsulating the pins exposed and a portion of each electric wire.

2. An LED lamp module according to claim 1, wherein each LED lamp is a full-colored LED lamp.

3. An LED lamp module according to claim 1, wherein the LED chips disposed on the substrate comprises a red LED chip, a green LED chip and a blue LED chip.

4. An LED lamp module according to claim 1, wherein the LED lamp has two pins or four pins.

5. An LED lamp module according to claim 1, wherein each LED lamp further comprises a plurality of bonding wires connected between the LED chips and the circuitries electrically.

6. An LED lamp module according to claim 1, wherein each substrate has a first surface and a second surface, the LED chip is disposed on the first surface, and the pins are protruded from the second surface.

7. An LED lamp module according to claim 6, wherein each LED lamp further comprises a control integrated circuitry disposed on the first surface or the second surface of the substrate, wherein each control integrated circuitry is encapsulated by one of the encapsulants.

8. An LED lamp module according to claim 7, further comprising an electrostatic protection circuitry integrated in each control integrated circuitry.

9. An LED lamp module according to claim 1, further comprising an electrostatic protection circuitry integrated in each circuitry of the substrate.

10. An LED lamp module according to claim 1, further comprising solder material, wherein the electric wires and the pins are welded by the solder material, and the solder material is encapsulated by the moisture-resisting members.

11. An LED lamp module according to claim 1, wherein each electric wire comprises:

an insulating layer; and

a conductive wire wrapped in the insulating layer, wherein an end of the conductive wire are exposed by the insulating layer, and the exposed end of the conductive wire is connected with one of the pins.

12. An LED lamp module according to claim 1, wherein the moisture-resisting members comprises plastics.

13. An LED lamp module according to claim 1, further comprising a plurality of ornaments covering the LED lamps.

14. An LED lamp module according to claim 1, wherein the ornaments comprises light-guiding members or light-reflecting members.