Optical semiconductor device

• US 20060163602A1
• Filed: 06/07/2004
• Published: 07/27/2006
• Est. Priority Date: 06/11/2003
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Isokawa, Shinji
• Granted Patent: US 7,429,759 B2
• Time in Patent Office: Days
• US Class Current: 257/100
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

An optical semiconductor device (A1) comprises a light reflector (5) and an optical semiconductor chip (3). The reflector (5) includes two first reflecting surfaces (50a) spaced from each other in direction x, and two second reflecting surfaces (50b) spaced from each other in direction y. The chip (3) includes a rectangular upper surface and a rectangular lower surface spaced from each other in direction z perpendicular to both of the directions x and y. The chip (3) further includes at least one light-emitting surface (31) extending between the upper and the lower surfaces. The light-emitting surface (31) faces a corresponding one of the second reflecting surfaces (50b). The light-emitting surface (31) is non-parallel to the corresponding second reflecting surfaces (50b) as viewed in parallel to the direction z.

Claims

1. An optical semiconductor device comprising:

a light reflector comprising two first reflecting surfaces spaced from each other in direction x and two reflecting surfaces spaced from each other in direction y perpendicular to the direction x; and

at least one optical semiconductor chip arranged between the two first reflecting surfaces and also between the two second reflecting surfaces;

wherein the optical semiconductor chip comprises a rectangular upper surface and a rectangular lower surface spaced to each other in direction z perpendicular to both of the directions x and y, the optical semiconductor chip further comprising at least one light-emitting surface extending between the upper surface and the lower surface,

wherein the first reflecting surfaces are inclined relative to the direction z at a first inclined angle, so that light emitted from the optical semiconductor chip is reflected in the direction z, and the second reflecting surfaces are inclined relative to the direction z at a second inclined angle smaller than the first inclined angle,

wherein the light-emitting surface of the optical semiconductor chip faces one of the second reflecting surfaces and is non-parallel to the facing second reflecting surface as viewed parallel to the direction z.

2. The optical semiconductor device according to claim 1, wherein the light-emitting surface of the optical semiconductor chip is non-parallel to both of the directions x and y.

3. The optical semiconductor device according to claim 1, wherein the light-emitting surface of the optical semiconductor chip is inclined relative to the direction x at 45°

.

4. The optical semiconductor device according to claim 1, wherein said one of the two second reflecting surfaces is non-parallel to both of the directions x and y.

5. The optical semiconductor device according to claim 1, wherein the reflector is a rectangular frame elongated in the direction x longer than in the direction y.

6. The optical semiconductor device according to claim 1 further comprising a second optical semiconductor chip arranged between the two first reflecting surfaces and also between the two second reflecting surfaces, wherein said one optical semiconductor chip and the second optical semiconductor chip are spaced from each other in the direction x.

7. The optical semiconductor device according to claim 1 further comprising a base plate for mounting the optical semiconductor chip and the reflector, wherein a wiring pattern is formed on the base plate and is electrically connected to the optical semiconductor chip.

8. The optical semiconductor device according to claim 1, wherein each of the upper surface and the lower surface of the optical semiconductor chip is square and the optical semiconductor chip includes four rectangular light-emitting surfaces extending between the upper and the lower surfaces, wherein one of two diagonals of the upper surface of the optical semiconductor chip is parallel to the direction x, while the other diagonal is parallel to the direction y.

9. The optical semiconductor device according to claim 8, wherein the light emitted from the four light-emitting surfaces is partly reflected by the second reflecting surfaces and then travels toward the first reflecting surfaces, while partly traveling directly to the first reflecting surfaces.

10. The optical semiconductor device according to claim 1, wherein the second inclined angle of the second reflecting surfaces is 0°

, and the first reflecting surfaces are rectangular.