IC chip package structure and underfill process
First Claim
1. An integrated circuit chip structure comprising:
- a carrier substrate;
a flip chip provided on said substrate;
a dam structure provided on said carrier substrate; and
an adhesive material provided between said carrier substrate and said flip chip.
1 Assignment
0 Petitions
Accused Products
Abstract
A novel integrated circuit (IC) chip package structure and underfill process which reduces stress applied to corners of a flip chip in an IC package structure during the application of an adhesive material between the flip chip and a carrier substrate is disclosed. The process includes providing a dam structure on a carrier substrate; attaching solder bumps of an inverted flip chip to the carrier substrate; injecting an adhesive material between the flip chip and the carrier substrate at multiple injection points located along adjacent edges of the flip chip; and injecting a sealant material around the adhesive material. During application of the adhesive material and the sealant material to the IC package structure in the underfill process, the dam structure reduces stress applied to the corners of the flip chip. This prevents or at least reduces de-lamination of dielectric layers on the flip chip.
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Citations
20 Claims
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1. An integrated circuit chip structure comprising:
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a carrier substrate;
a flip chip provided on said substrate;
a dam structure provided on said carrier substrate; and
an adhesive material provided between said carrier substrate and said flip chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An integrated circuit chip structure comprising:
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a carrier substrate and a generally rectangular flip chip provided on said carrier substrate;
a dam structure provided on said carrier substrate;
an adhesive material provided between said carrier substrate and said flip chip; and
a sealant material provided around said adhesive material. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. An integrated circuit chip structure, comprising:
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a carrier substrate;
a plurality of dam elements provided on said carrier substrate;
a flip chip attached to said carrier substrate, with respective corners of said flip chip disposed adjacent to said dam elements, respectively;
an adhesive material provided between said carrier substrate and said flip chip; and
a sealant material provided around said adhesive material. - View Dependent Claims (18, 19, 20)
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Specification