Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device

• US 20060164466A1
• Filed: 01/23/2006
• Published: 07/27/2006
• Est. Priority Date: 01/25/2005
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Mizuno, Shinji, Nishiyama, Yoshihide, Sato, Eiichi
• Granted Patent: US 7,595,562 B2
• Time in Patent Office: Days
• US Class Current: 347/58
• CPC Class Codes: B41J 2/14233 of film type, deformed by bending and disposed on a diaphragm
• CPC Class Codes: B41J 2002/14241 having a cover around the piezoelectric thin film element
• CPC Class Codes: B41J 2002/14362 Assembling elements of heads
• CPC Class Codes: B41J 2002/14419 Manifold
• CPC Class Codes: B41J 2002/14491 Electrical connection
• CPC Class Codes: B41J 2202/18 Electrical connection established using vias
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]

Abstract

A device package structure includes: a base body having a conductive connection portion and a level difference portion; a device arranged on the base body, having a connection terminal electrically connected to the conductive connection portion via the level difference portion on the base body; and a connector electrically connecting the connection terminal and the conductive connection portion, having substantially the same height as a height of the level difference portion.

Claims

1. A device package structure comprising:

a base body having a conductive connection portion and a level difference portion;

a device arranged on the base body, having a connection terminal electrically connected to the conductive connection portion via the level difference portion on the base body; and

a connector electrically connecting the connection terminal and the conductive connection portion, having substantially the same height as a height of the level difference portion.

2. A device package structure according to claim 1, further comprising:

a connector laminated body having a plurality of the connectors in laminations, wherein the connector laminated body is arranged between the connection terminal of the device and the conductive connection portion of the base body.

3. A device package structure according to claim 1, wherein the connector includes:

a base member; and

a terminal electrode.

4. A device package structure according to claim 3, wherein the terminal electrode pierces through the base member.

5. A device package structure according to claim 3, wherein the base member of the connector, includes:

a first face;

a second face of an opposite side of the first face; and

a third face being difference of the first face and the second face;

the terminal electrode of the connector, includes;

a first terminal electrode formed on the first face of the base member;

a second terminal electrode formed on the second face of the base member; and

a connection wiring formed on the third face of the base member, electrically connecting between the first terminal and the second terminal.

6. A device package structure according to claim 3, wherein the base member of the connector is a glass epoxy, Si, a ceramic, or a glass.

7. A device package structure according to claim 3, wherein a constituent material of the terminal electrode of the connector is any one of:

a metal material selected from a group consisting of Cu, Ni, Au, and Ag;

an alloy of a metal material selected from the same group;

a brazing filler metal; and

a conductive resin material.

8. A device package structure according to claim 1, further comprising:

a through hole piercing through the base body, wherein the conductive connection portion is formed on an outer face or an inner face of the base body, the through hole reaching the conductive connection portion, the connector is arranged in the through hole, and the connector electrically connecting between the connection terminal of the device and the conductive connection portion.

9. A semiconductor device comprising:

a base body; and

an electronic device packaged on the base body using the device package structure according to claim 1.

10. A device package structure comprising:

a base body having a conductive connection portion and a level difference portion;

a device arranged on the base body, having a connection terminal electrically connected to the conductive connection portion via the level difference portion on the base body; and

a connector electrically connecting the connection terminal and the conductive connection portion, having a height greater than a height of the level difference portion.

11. A device package structure according to claim 10, further comprising:

a connector laminated body having a plurality of the connectors in laminations, wherein the connector laminated body is arranged between the connection terminal of the device and the conductive connection portion of the base body.

12. A device package structure according to claim 10, wherein the connector includes:

a base member; and

a terminal electrode.

13. A device package structure according to claim 12, wherein the terminal electrode pierces through the base member.

14. A device package structure according to claim 12, wherein the base member of the connector, includes:

a first face;

a second face of an opposite side of the first face; and

a third face being difference of the first face and the second face;

the terminal electrode of the connector, includes;

a first terminal electrode formed on the first face of the base member;

a second terminal electrode formed on the second face of the base member; and

a connection wiring formed on the third face of the base member, electrically connecting between the first terminal and the second terminal.

15. A device package structure according to claim 12, wherein the base member of the connector is a glass epoxy, Si, a ceramic, or a glass.

16. A device package structure according to claim 12, wherein a constituent material of the terminal electrode of the connector is any one of:

a metal material selected from a group consisting of Cu, Ni, Au, and Ag;

an alloy of a metal material selected from the same group;

a brazing filler metal; and

a conductive resin material.

17. A device package structure according to claim 10, further comprising:

a through hole piercing through the base body, wherein the conductive connection portion is formed on an outer face or an inner face of the base body, the through hole reaching the conductive connection portion, the connector is arranged in the through hole, and the connector electrically connecting between the connection terminal of the device and the conductive connection portion.

18. A semiconductor device comprising:

a base body; and

an electronic device packaged on the base body using the device package structure according to claim 10.

19. A device package structure comprising:

a base body, including a first face, a level difference portion, and a, second face formed on the first face via the level difference portion;

a first conductive connection portion formed on the first face;

a device arranged on the base body, having a connection terminal arranged on the second face and electrically connected to the first conductive connection portion;

a second conductive connection portion formed on the second face and electrically connected to the connection terminal of the device; and

a connector electrically connecting the first conductive connection portion and the second conductive connection portion, having the same height as a height of the level difference portion.

20. A device package structure according to claim 19, wherein the connector includes:

a first terminal electrode connected to the first conductive connection portion;

a second terminal electrode connected to the second conductive connection portion; and

a connection wiring electrically connecting the first terminal electrode and the second terminal electrode.

21. A device package structure according to claim 20, wherein the connector has an inclined-face between a face on which the first terminal electrode is formed, and a face on which the second terminal electrode is formed, and the connection wiring is formed on the inclined-face.

22. A device package structure according to claim 20, wherein the first terminal electrode is formed with a first conductive projected portion, the second terminal electrode is formed with a second conductive projected portion.

23. A device package structure according to claim 20, wherein a constituent material of at least either one of the first terminal electrode and the second terminal electrode is any one of:

a metal material selected from a group consisting of Cu, Ni, Au, and Ag;

an alloy of a metal material selected from the same group;

a brazing filler metal; and

a conductive resin material.

24. A device package structure according to claim 19, wherein a coefficient of linear expansion of the base body and a coefficient of linear expansion of the connector are substantially same.

25. A device package structure according to claim 19, wherein the device is formed with a first conductive projected portion, the connector is formed with a second conductive projected portion, the device and the base body is electrically connected via the first conductive projected portion, the connector and the base body is electrically connected via the second conductive projected portion.

26. A device package structure according to claim 19, wherein the base member of the connector is a glass epoxy, Si, a ceramic, or a glass.

27. A device package structure according to claim 19, wherein the connector has a mark for detecting a position when the connector is packaged on the base body.

28. A droplet ejection head comprising:

a nozzle opening ejecting droplets;

a pressure generating chamber communicating the nozzle opening;

a drive element arranged outside of the pressure generating chamber, generating a pressure change in the pressure generating chamber;

a protective substrate provided on an opposite side to the pressure generating chamber in relation to the drive element;

a driving circuit unit provided on an opposite side to the drive element in relation to the protective substrate, supplying an electric signal to the drive element; and

a circuit connecting portion of the drive element, electrically connected to the driving circuit unit by the device package structure according to claim 19.

29. A semiconductor device comprising:

a base body; and

an electronic device packaged on the base body by the device package structure according to claim 19.

30. A device packaging method comprising:

preparing a base body having a conductive connection portion and a level difference portion;

arranging a device having a connection terminal, on the base body;

arranging a connector on the base body, the connector having substantially the same height as a height of the level difference portion formed between the connection terminal of the device and the conductive connection portion, when the device is arranged on the base body;

electrically connecting the connector to the conductive connection portion;

electrically connecting the connection terminal of the device to the connector; and

electrically connecting the connection terminal and the conductive connection portion.

31. A device packaging method according to claim 30, further comprising:

electrically connecting the connection terminal of the device to the conductive connection portion.

32. A device packaging method according to claim 30, further comprising:

electrically connecting the connection terminal of the device to the terminal electrode of the connector.

33. A device packaging method according to claim 30, wherein the connector has a base member and a terminal electrode piercing through the base member, and the conductive connection portion of the base body and the connection terminal of the device are electrically connected by the terminal electrode of the connector.

34. A device packaging method according to claim 33, further comprising:

forming a connector laminated body having a plurality of the connectors laminated so as to electrically connect adjacent terminal electrodes of the connectors; and

electrically connecting the conductive connection portion of the base body and the connection terminal of the device by the terminal electrode of the connector.

35. A device packaging method according to claim 30, further comprising:

using the connector including,

a base member having a first face,

a second face of an opposite side of the first face,

a third face being difference of the first face and the second face,

a first terminal electrode formed on the first face of the base member,

a second terminal electrode formed on the second face of the base member, and

a connection wiring formed on the third face of the base member, electrically connecting between the first terminal and the second terminal;

electrically connecting the first terminal electrode and the conductive connection portion of the base body;

electrically connecting the second terminal electrode and the connection terminal of the device; and

electrically connecting the connection terminal and the conductive connection portion.

36. A device packaging method, comprising:

preparing a base body having a conductive connection portion and a level difference portion;

arranging a device having a connection terminal, on the base body;

arranging a connector on the base body, the connector having a height greater than a height of the level difference portion formed between the connection terminal of the device and the conductive connection portion, when the device is arranged on the base body;

electrically connecting the connector to the conductive connection portion;

electrically connecting the connection terminal of the device to the connector; and

electrically connecting the connection terminal and the conductive connection portion.

37. A device packaging method according to claim 36, further comprising:

electrically connecting the connection terminal of the device to the conductive connection portion.

38. A device packaging method according to claim 36, further comprising:

electrically connecting the connection terminal of the device to the terminal electrode of the connector.

39. A device packaging method according to claim 36, wherein the connector has a base member and a terminal electrode piercing through the base member, and the conductive connection portion of the base body and the connection terminal of the device are electrically connected by the terminal electrode of the connector.

40. A device packaging method according to claim 39, further comprising:

forming a connector laminated body having a plurality of the connectors laminated so as to electrically connect adjacent terminal electrodes of the connectors, and electrically connecting the conductive connection portion of the base body, and the connection terminal of the device by the terminal electrode of the connector.

41. A device packaging method according to claim 36, further comprising:

using the connector including,

a base member having a first face,

a second face of an opposite side of the first face,

a third face being difference of the first face and the second face,

a first terminal electrode formed on the first face of the base member,

a second terminal electrode formed on the second face of the base member, and

a connection wiring formed on the third face of the base member, electrically connecting between the first terminal and the second terminal;

electrically connecting the first terminal electrode and the conductive connection portion of the base body;

electrically connecting the second terminal electrode and the connection terminal of the device; and

electrically connecting the connection terminal and the conductive connection portion.

42. A connector comprising:

a first terminal electrode;

a second terminal electrode provided on the first terminal electrode via a level difference portion; and

a connection wiring formed on the level difference portion, electrically connecting between the first terminal electrode and the second terminal electrode.

43. A connector according to claim 42, further comprising:

an inclined-face between a face on which the first terminal electrode is formed, and a face on which the second terminal electrode is formed; and

the connection wiring formed on the inclined-face.

44. A connector according to claim 42, wherein the first terminal electrode is formed with a first conductive projected portion, the second terminal electrode is formed with a second conductive projected portion.

45. A connector according to claim 42, further comprising:

a mark for detecting a position when the connector is packaged on the base body.

46. A device packaging method, comprising:

preparing a base body having a first face, a level difference portion, a second face formed on the first face via the level difference portion, a first conductive connection portion formed on the first face;

forming a second conductive connection portion;

arranging a connection terminal of a device on the second face, so as to connect the a connection terminal and the second conductive connection portion;

electrically connecting the first conductive connection portion and the second conductive connection portion via a connector having a height at least substantially the same height as a height of the level difference portion; and

connecting the first conductive connection portion and the connection terminal of the device.

47. A device packaging method according to claim 46, further comprising:

forming a first conductive projected portion on the device;

forming a second conductive projected portion on the connector;

electrically connecting the device and the base body via the first conductive projected portion; and

electrically connecting the connector and the base body via the second conductive projected portion.