Communication module
First Claim
1. A communication module comprising:
- a semiconductor member;
a flexible printed circuit board on which said semiconductor member is mounted and to which said semiconductor member is electrically connected;
a stem through which said board is inserted and to which said board is then fixed; and
a cap so disposed as to cover said semiconductor member.
1 Assignment
0 Petitions
Accused Products
Abstract
A communication module that may be smaller in size but capable of providing a high-rate communication with an excellent high frequency characteristic includes a semiconductor laser (LD) (10); a flexible printed circuit board (FPC) (11) on which the LD (10) is mounted and to which the LD (10) is electrically connected; a stem (12) through which the FPC (11) is inserted and to which the FPC (11) is then fixed; and a cap (13) so disposed as to cover the LD (10). The FPC (11) is used, instead of lead pins, to supply a power to the LD (10), derive signals therefrom and so on, whereby the high frequency characteristic can be improved. In addition, employment of a package structure comprising the stem (12) and cap (13) realizes the smaller size.
65 Citations
6 Claims
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1. A communication module comprising:
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a semiconductor member;
a flexible printed circuit board on which said semiconductor member is mounted and to which said semiconductor member is electrically connected;
a stem through which said board is inserted and to which said board is then fixed; and
a cap so disposed as to cover said semiconductor member. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification