Radial circuit board, system, and methods
First Claim
Patent Images
1. A circuit board module comprising:
- a connector;
a plurality of components radially arrayed substantially equidistant around said connector; and
an array of substantially equidistant electrical connections electrically coupling said connector and said components.
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Accused Products
Abstract
The present invention relates to circuit boards with radially arrayed components. One specific embodiment is a memory circuit board with memory components, such as, for example, DRAM chips, radially arrayed around a central point. The present invention also relates to stacking and connecting multiple circuit boards with radially arrayed components. Another embodiment of the invention involves methods of preparing radially arrayed components on a circuit board module with substantially equidistant paths to the components.
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Citations
44 Claims
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1. A circuit board module comprising:
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a connector;
a plurality of components radially arrayed substantially equidistant around said connector; and
an array of substantially equidistant electrical connections electrically coupling said connector and said components. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. An apparatus comprising:
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a first circuit board module with memory chips radially disposed;
a main circuit board;
an apparatus for connecting said first circuit board module to said main circuit board;
an input-output device on said first circuit board module located in a position that is approximately equal distant from each of the memory chips;
a first array of equidistant electrical connection lines between said input-output device and said memory chips; and
a second array of electrical connection lines between said input-output device and said apparatus for connecting said circuit board to said main circuit board. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27)
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28. A method of manufacturing comprising:
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providing a circuit board module;
providing a circuit board module connector on said circuit board module;
disposing a plurality of components radially about said connector; and
electrically connecting said components to said circuit board module connector. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36)
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37. A method of stacking circuit board modules comprising:
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providing a main circuit board with a connector; and
providing first and second circuit board modules with components radially disposed substantially equidistance from a connector on said circuit board module;
wherein said first circuit board is connected to said main circuit board and said second circuit board is connected to said first circuit board. - View Dependent Claims (38, 39)
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40. A method of stacking circuit board modules comprising:
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providing a main circuit board with a post comprising a predetermined cross-sectional shape;
providing a first and second circuit board module with components radially disposed substantially equidistant from an aperture that is congruent with a peripheral edge of said predetermine cross-sectional shape of said post;
stacking said first and second circuit board modules one upon another; and
coupling said first and second circuit board modules with said post. - View Dependent Claims (41, 42, 43, 44)
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Specification