Optical sensor

• US 20060165294A1
• Filed: 02/12/2003
• Published: 07/27/2006
• Est. Priority Date: 02/12/2002
• Status: Active Grant

• Current Assignee: Hamamatsu Photonics KK
• Original Assignee: Hamamatsu Photonics KK
• Inventors: Mizuno, Seiichiro, Yamanaka, Tatsumi, Fuji, Yoshimoto
• Granted Patent: US 7,336,808 B2
• Time in Patent Office: Days
• US Class Current: 382/224
• CPC Class Codes: G01J 1/44 Electric circuits for command of an exposure part G03B7/02
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04N 25/778 comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself

Abstract

Photodetector 1 is equipped with photodiodes PDn, integrating circuits 10n, CDS circuits 20n, and hold circuits 30n. Each integrating circuit 10n includes an amplifier 11n, a capacitor C, and a switch SW. Photodiodes PDn are aligned on a first substrate 100. A differential pair input part (transistors T₁ and T₂) of amplifier 11n, capacitor C, etc., of each integrating circuit 10n are disposed on a second substrate 200. A drive part (transistors T₅ and T₆) of amplifier 11n, etc., of each integrating circuit 10n are disposed on a third substrate 300.

Claims

1. A photodetector comprising:

a plurality of photodiodes, each generating charges of an amount that is in accordance with the intensity of incident light; and

integrating circuits, each including an amplifier, having a differential pair input part at the input end side and a drive part at the output end side, and a capacitor and a switch, which are disposed between said input end and said output end of said amplifier, and, when said switch is opened, accumulating, in the capacitor, charges input into said input end from an above-mentioned photodiode and outputting, from said output end, a voltage that is in accordance with the amount of charges accumulated in said capacitor,

said plurality of photodiodes being disposed on a first substrate,

said capacitors and said differential pair input parts being disposed on a second substrate,

said drive parts being disposed on a third substrate, and

said photodiodes and said input ends of said integrating circuits being electrically connected to each other by said first substrate and said second substrate being bump-connected to each other.

2. The photodetector according to claim 1, wherein said second substrate and said third substrate are bump-connected to each other.

3. A photodetector comprising:

a plurality of photodiodes, each generating charges of an amount that is in accordance with the intensity of incident light; and

integrating circuits, each including an amplifier, having a differential pair input part at the input end side and a drive part at the output end side, and a capacitor and a switch, which are disposed between said input end and said output end of said amplifier, and, when said switch is opened, accumulating, in the capacitor, charges input into said input end from an above-mentioned photodiode and outputting, from said output end, a voltage that is in accordance with the amount of charges accumulated in said capacitor,

said plurality of photodiodes being disposed on a first substrate,

said capacitors, said differential pair input parts, and said drive parts being disposed on a second substrate,

said photodiodes and said input ends of the integrating circuits being electrically connected to each other by said first substrate and said second substrate being bump-connected to each other,

said capacitors and said differential pair input parts being disposed in a first region on said second substrate that overlaps with a region on said first substrate in which said plurality of photodiodes are disposed, and

said drive parts are disposed in a second region on said second substrate that does not overlap with the region on said first substrate in which said plurality of photodiodes are disposed.