Plasma detection and associated systems and methods for controlling microfeature workpiece deposition processes

• US 20060165873A1
• Filed: 01/25/2005
• Published: 07/27/2006
• Est. Priority Date: 01/25/2005
• Status: Abandoned Application

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Rueger, Neal R., Sant, Sanket
• Application Number:
  US11/043,629
• Publication Number:
  US 20060165873A1
• Time in Patent Office: Days
• US Class Current: 427/8
• CPC Class Codes: C23C 16/45525 Atomic layer deposition [ALD]
• CPC Class Codes: C23C 16/45542 Plasma being used non-continuously during the ALD reactions
• CPC Class Codes: C23C 16/511 using microwave discharges
• CPC Class Codes: C23C 16/52 Controlling or regulating the coating process C23C16/45557, C23C16/279 take precedence
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge

Abstract

Systems and methods for detecting plasmas and/or controlling microfeature workpiece deposition processes are disclosed. A method in accordance with one embodiment includes placing a microfeature workpiece in a plasma chamber, detecting a plasma in the plasma chamber while the microfeature workpiece is in the plasma chamber, and controlling processing of the microfeature workpiece in the plasma chamber based at least in part on the detection of the plasma. A controller in accordance with another embodiment of the invention can be configured to receive an indication of plasma initiation, track an exposure time based on the indication of plasma initiation, and compare the exposure time to a target value. If the exposure time meets or exceeds the target value, the controller can direct the plasma to be extinguished. If an indication that the plasma has been extinguished is received prior to the target exposure time being met, the controller can halt tracking the exposure time, await an indication of plasma re-initiation, and restart tracking the exposure time when the indication of plasma re-initiation is received.

Claims

1. A method for depositing material on a microfeature workpiece, comprising:

placing the microfeature workpiece in a plasma chamber;

detecting a plasma in the plasma chamber while the microfeature workpiece is in the plasma chamber; and

controlling processing of the microfeature workpiece in the plasma chamber based at least in part on the detection of the plasma.

2. The method of claim 1 wherein detecting a plasma includes detecting initiation of a plasma.

3. The method of claim 1 wherein detecting a plasma includes detecting a radiative emission from atoms within the plasma chamber.

4. The method of claim 1 wherein detecting a plasma includes detecting an optical emission from atoms within the plasma chamber.

5. The method of claim 1 wherein detecting a plasma includes detecting a concentration of ions in the plasma chamber.

6. The method of claim 1, further comprising:

introducing a gas into the plasma chamber;

directing electromagnetic energy into the plasma chamber; and

striking the plasma in the plasma chamber by ionizing at least a portion of the gas in the chamber.

7. The method of claim 1 wherein detecting a plasma includes detecting a first initiation of the plasma, and wherein the method further comprises:

detecting a first extinction of the plasma in the plasma chamber while the microfeature workpiece is in the plasma chamber;

determining an amount of time during which the microfeature workpiece is exposed to the plasma based at least in part on the detected first initiation of the plasma and the detected first extinction of the plasma;

detecting a second initiation of the plasma in the plasma chamber while the microfeature workpiece is in the plasma chamber;

detecting a second extinction of the plasma in the plasma chamber while the microfeature workpiece is in the plasma chamber; and

updating the amount of time during which the microfeature workpiece is exposed to the plasma based at least in part on the detected second initiation of the plasma and the detected second extinction of the plasma.

8. The method of claim 1 wherein detecting a plasma includes detecting initiation of a plasma, and wherein the method further comprises:

detecting extinction of the plasma in the plasma chamber while the microfeature workpiece is in the plasma chamber; and

determining an amount of time during which the microfeature workpiece is exposed to the plasma based at least in part on the detected initiation of the plasma and the detected extinction of the plasma.

9. The method of claim 1 wherein detecting a plasma includes detecting initiation of the plasma, based on a first signal from a photosensitive diode, and wherein the method further comprises:

(a) detecting extinction of the plasma in the plasma chamber while the microfeature workpiece is in the plasma chamber, based on a second signal received from the photosensitive diode; and

determining an amount of time during which the microfeature workpiece is exposed to the plasma based at least in part on the detected initiation of the plasma and the detected extinction of the plasma;

or

(b) extinguishing the plasma after a threshold period of time has elapsed;

or

(c) both (a) and (b).

10. The method of claim 1, further comprising detecting extinction of the plasma in the plasma chamber.

11. The method of claim 1 wherein controlling a process includes:

receiving an indication of a target plasma exposure time for the microfeature workpiece; and

extinguishing the plasma after the target period of time has elapsed.

12. The method of claim 1 wherein controlling a process includes:

determining an amount of time during which the microfeature workpiece is exposed to the plasma based at least in part on the detection of the plasma;

comparing the amount of time to a target plasma exposure time for the microfeature workpiece; and

extinguishing the plasma in response to the amount of time meeting or exceeding the target plasma exposure time.

13. The method of claim 1, further comprising rotating the microfeature workpiece while the microfeature workpiece is exposed to the plasma.

14. The method of claim 1 wherein detecting a plasma in the plasma chamber includes detecting the plasma via at least one of a plurality of detectors positioned at least proximate to the plasma chamber.

15. A method for controlling a plasma process, comprising:

automatically detecting a plasma in a plasma chamber;

exposing a target to the plasma; and

automatically controlling a time during which the target is exposed to the plasma based at least in part on the detection of the plasma.

16. The method of claim 15 wherein exposing a target includes exposing a microfeature workpiece to deposit material on the microfeature workpiece.

17. The method of claim 15 wherein detecting a plasma includes detecting initiation of a plasma.

18. The method of claim 15 wherein detecting a plasma includes detecting a radiative emission from atoms within the plasma chamber.

19. The method of claim 15 wherein detecting a plasma includes detecting a first initiation of the plasma, and wherein the method further comprises:

detecting a first extinction of the plasma in the plasma chamber while the target is in the plasma chamber;

determining an amount of time during which the target is exposed to the plasma based at least in part on the detected first initiation of the plasma and the detected first extinction of the plasma;

detecting a second initiation of the plasma in the plasma chamber while the target is in the plasma chamber;

detecting a second extinction of the plasma in the plasma chamber while the target is in the plasma chamber; and

updating the amount of time during which the target is exposed to the plasma based at least in part on the detected second initiation of the plasma and the detected second extinction of the plasma.

20. The method of claim 15 wherein detecting a plasma includes detecting initiation of a plasma, and wherein the method further comprises:

detecting extinction of the plasma in the plasma chamber while the target is in the plasma chamber; and

determining an amount of time during which the target is exposed to the plasma based at least in part on the detected initiation of the plasma and the detected extinction of the plasma.

21. The method of claim 15, further comprising detecting extinction of the plasma in the plasma chamber.

22. The method of claim 15 wherein controlling a process includes:

receiving an indication of a pre-selected plasma exposure time for the target; and

extinguishing the plasma after the pre-selected period of time has elapsed.

23. The method of claim 15 wherein detecting a plasma in the plasma chamber includes detecting the plasma via at least one of a plurality of detectors positioned at least proximate to the plasma chamber.

24. A method for depositing material on a microfeature workpiece, comprising:

placing the microfeature workpiece in a plasma chamber;

reducing a pressure in the plasma chamber;

igniting constituents in the plasma chamber;

detecting ignition of constituents in the plasma chamber based on a first signal received from a photosensitive diode; and

(a) detecting extinction of the plasma in the plasma chamber while the microfeature workpiece is in the plasma chamber, based on a second signal received from the photosensitive diode; and

determining an amount of time during which the microfeature workpiece is exposed to the ignited plasma based at least in part on the detected initiation of the plasma and the detected extinction of the plasma;

or

(b) extinguishing the ignited constituents after a threshold period of time has elapsed;

or

(c) both (a) and (b).

25. The method of claim 24 wherein detecting ignition includes detecting a first initiation of the plasma, and wherein detecting extinction of the plasma includes detecting a first extinction of the plasma, and wherein the method further comprises:

detecting a second initiation of the plasma in the plasma chamber while the microfeature workpiece is in the plasma chamber;

detecting a second extinction of the plasma in the plasma chamber while the microfeature workpiece is in the plasma chamber; and

updating the amount of time during which the microfeature workpiece is exposed to the plasma based at least in part on the detected second initiation of the plasma and the detected second extinction of the plasma.

26. A method for controlling plasma exposure time, comprising:

receiving an indication of plasma initiation;

tracking an exposure time based at least in part on the indication of plasma initiation;

comparing the exposure time to a target value for exposure time;

if the exposure time meets or exceeds the target value, directing the plasma to be extinguished; and

if an indication that the plasma has been extinguished is received prior to the exposure time meeting or exceeding the target value, then

(a) halting tracking the exposure time;

(b) awaiting an indication of plasma re-initiation; and

(c) restarting tracking the exposure time when the indication of plasma re-initiation is received.

27. The method of claim 26 wherein tracking an exposure time includes tracking a time during which a microfeature workpiece is exposed to the plasma.

28. The method of claim 26 wherein receiving an indication of plasma initiation includes receiving an indication of plasma initiation from an optical detector.

29. The method of claim 26 wherein receiving an indication of plasma initiation includes receiving an indication of plasma initiation from a photosensitive diode.

30. A computer-readable medium for controlling operation of a plasma chamber, comprising:

a receiver portion configured to receive a signal corresponding to the presence of a plasma in a plasma chamber;

a timer portion configured to determine a period of time during which the plasma is present in the plasma chamber, based at least in part of the received signal; and

a control portion configured to direct a control signal that controls a power source used to initiate the plasma.

31. The computer-readable medium of claim 30 wherein the receiver portion is configured to receive a signal corresponding to the initiation of a plasma.

32. The computer-readable medium of claim 30 wherein the receiver portion is configured to receive a signal corresponding to a first initiation of a plasma while a target is present in the plasma chamber, and wherein:

the receiver portion is configured to receive a signal corresponding to a first extinction of the plasma in the plasma chamber;

the timer portion is configured to determine an amount of time during which the target is exposed to the plasma based at least in part on the detected first initiation of the plasma and the detected first extinction of the plasma;

the receiver portion is configured to receive a signal corresponding to a second initiation of the plasma in the plasma chamber while the target is in the plasma chamber;

the receiver portion is configured to receive a signal corresponding to a second extinction of the plasma in the plasma chamber while the target is in the plasma chamber; and

the timer portion is configured to update the amount of time during which the target is exposed to the plasma based at least in part on the detected second initiation of the plasma and the detected second extinction of the plasma.

33. The computer-readable medium of claim 30 wherein:

the receiver portion is configured to receive a first signal corresponding to an initiation of the plasma and a second signal corresponding to an extinction of the plasma in the plasma chamber while a target is in the plasma chamber; and

the timer portion is configured to determine an amount of time during which the target is exposed to the plasma based at least in part on the detected initiation of the plasma and the detected extinction of the plasma.

34. The computer-readable medium of claim 30 wherein the receiver portion is configured to receive a signal corresponding to extinction of the plasma in the plasma chamber.

35. The computer-readable medium of claim 30 wherein the control portion is configured to extinguish the plasma after a pre-selected period of time has elapsed.

36. An apparatus for applying material to a microfeature workpiece, comprising:

a plasma chamber coupleable to a source of gas;

a support positioned within the plasma chamber and configured to carry a microfeature workpiece;

an energy source positioned at least proximate to the plasma chamber to impart energy to atoms within the plasma chamber;

a detector positioned to detect the presence of a plasma within the plasma chamber; and

a controller operatively coupled to the energy source and the detector to control operation of the energy source based at least in part on a signal received from the detector.

37. The apparatus of claim 36 wherein the detector includes a photosensitive diode.

38. The apparatus of claim 36 wherein the detector is configured to detect a presence of ions in the plasma chamber.

39. The apparatus of claim 36 wherein the detector is configured to detect both the presence and absence of a plasma, and wherein the controller is configured to track an amount of time during which the plasma is ignited based at least in part on signals received from the detector.

40. The apparatus of claim 36 wherein the detector includes a photodetector having a window positioned to be in a direct line of sight with an interior region of the plasma chamber, and wherein the detector further includes a shield positioned proximate to the window to at least restrict deposition of material on the window.

41. The apparatus of claim 36 wherein the detector is one of a plurality of detectors positioned to detect the presence of a plasma within the plasma chamber.

42. The apparatus of claim 36 wherein the support is rotatable relative to the plasma chamber.

43. An apparatus for applying material to a microfeature workpiece, comprising:

a plasma chamber coupleable to a source of gas;

a support positioned within the plasma chamber and configured to carry a microfeature workpiece;

an energy source positioned at least proximate to the plasma chamber to impart energy to atoms within the plasma chamber;

a photodetector positioned to detect the presence of a plasma within the plasma chamber based on photon emissions from the plasma; and

a controller operatively coupled to the energy source and the detector to control operation of the energy source based at least in part on a signal received from the detector, the controller being configured to;

receive an indication of plasma initiation;

track an exposure time based on the indication of plasma initiation;

compare the exposure time to a target value for exposure time;

if the exposure time meets or exceeds the target value, direct the plasma to be extinguished; and

if an indication that the plasma has been extinguished is received prior to the exposure time meeting or exceeding the target value, then

(a) halt tracking the exposure time;

(b) await an indication of plasma re-initiation; and

(c) restart tracking the exposure time when the indication of plasma re-initiation is received.

44. The apparatus of claim 43 wherein the support is rotatable relative to the plasma chamber.

45. The apparatus of claim 43 wherein the photodetector is one of multiple photodetectors.

46. An apparatus for applying material to a microfeature workpiece, comprising:

a plasma chamber coupleable to a source of gas;

a support positioned within the plasma chamber and configured to carry a microfeature workpiece;

an energy source positioned at least proximate to the plasma chamber to impart energy to atoms within the plasma chamber;

detection means for detecting the presence of a plasma within the plasma chamber; and

control means operatively coupled to the energy source and the detector means to control operation of the energy source based at least in part on a signal received from the detection means.

47. The apparatus of claim 46 wherein the control means is configured to:

receive an indication of plasma initiation;

track an exposure time based on the indication of plasma initiation;

compare the exposure time to a target value for exposure time;

if the exposure time meets or exceeds the target value, direct the plasma to be extinguished; and

if an indication that the plasma has been extinguished is received prior to the exposure time meeting or exceeding the target value, then

(a) halt tracking the exposure time;

(b) await an indication of plasma re-initiation; and

(c) restart tracking the exposure time when the indication of plasma re-initiation is received.

48. The apparatus of claim 46 wherein the control means includes a computer-readable medium.

49. The apparatus of claim 46 wherein the detection means includes a photodetector.