Mold cavity identification markings for IC packages

• US 20060166381A1
• Filed: 08/30/2005
• Published: 07/27/2006
• Est. Priority Date: 01/26/2005
• Status: Abandoned Application

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Lange, Bernhard P.
• Application Number:
  US11/215,539
• Publication Number:
  US 20060166381A1
• Time in Patent Office: Days
• US Class Current: 438/14
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2223/54486 Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention provides small-feature identifying markings for tracing completed IC packages to individual mold cavities. Preferred embodiments of the invention include IC packages and associated methods for forming indicia in a surface of an integrated circuit package in an arrangement indicative of a particular mold cavity. The indicia may be read to determine the particular mold cavity associated with the manufacture of an individual integrated circuit package. Preferred embodiments of the invention are included using surface dot or indentation indicia configured in a binary code arrangement.

Claims

1. An integrated circuit package marking method comprising the steps of:

forming a plurality of indicia on a surface of an integrated circuit package, the indicia placed in an arrangement indicative of a particular mold cavity;

reading the plurality of indicia on the integrated circuit package to determine the mold cavity associated with the particular integrated circuit package.

2. A method according to claim 1 further comprising the step of forming the plurality of indicia in a binary code arrangement.

3. A method according to claim 1 wherein the step of forming indicia further comprises forming a plurality of indentations in the integrated circuit package.

4. A method according to claim 1 wherein the step of forming indicia further comprises forming a plurality of textured dots in the surface of integrated circuit package.

5. A method according to claim 1 further comprising the step of forming the plurality of indicia on the bottom of the package.

6. A method according to claim 1 further comprising the step of forming the plurality of indicia between package leads.

7. A method according to claim 1 further comprising the step of forming the plurality of indicia on the top of the package.

8. A method according to claim 1 further comprising the step of forming the plurality of indicia on a side of the package.

9. A method according to claim 1 further comprising the step of forming the plurality of indicia on an edge of the package.

10. An integrated circuit package comprising:

a semiconductor die encapsulated in mold compound;

a plurality of indicia indentations in a surface of the mold compound, the indicia disposed in an arrangement indicative of a particular mold cavity.

11. An integrated circuit package according to claim 10 wherein the indicia are disposed in a binary code arrangement.

12. An Integrated circuit package according to claim 10 wherein the plurality of indicia are located on the bottom of the package.

13. An Integrated circuit package according to claim 10 wherein the plurality of indicia are located between package leads.

14. An Integrated circuit package according to claim 10 wherein the plurality of indicia are located on the top of the package.

15. An Integrated circuit package according to claim 10 wherein the plurality of indicia are located on a side of the package.

16. An Integrated circuit package according to claim 10 wherein the plurality of indicia are located on an edge of the package.

17. An integrated circuit package comprising:

a semiconductor die encapsulated in mold compound;

a plurality of surface dot indicia in a surface of the mold compound, the indicia disposed in an arrangement indicative of a particular mold cavity.

18. An integrated circuit package according to claim 17 wherein the indicia are disposed in a binary code arrangement.

19. An Integrated circuit package according to claim 17 wherein the plurality of indicia are located on the bottom of the package.

20. An Integrated circuit package according to claim 17 wherein the plurality of indicia are located between package leads.

21. An Integrated circuit package according to claim 17 wherein the plurality of indicia are located on the top of the package.

22. An Integrated circuit package according to claim 17 wherein the plurality of indicia are located on a side of the package.

23. An Integrated circuit package according to claim 17 wherein the plurality of indicia are located on the edge of the package.