×

Interconnection of through-wafer vias using bridge structures

  • US 20060166480A1
  • Filed: 01/26/2005
  • Published: 07/27/2006
  • Est. Priority Date: 06/02/2004
  • Status: Active Grant
First Claim
Patent Images

1. A method for forming an interconnection in a capped or stacked wafer device, the method comprising:

  • forming a bridge structure on a first wafer device;

    bonding the first wafer device to a second wafer device such that the bridge structure at least partially spans a gap between a through-hole via in one of the wafers and a corresponding component on the other wafer; and

    forming an interconnection to the component through the through-hole via across the bridge structure.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×