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Substrate mapping

  • US 20060168552A1
  • Filed: 03/22/2006
  • Published: 07/27/2006
  • Est. Priority Date: 08/22/2001
  • Status: Abandoned Application
First Claim
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1. An evaluation method for die sites of a substrate comprising:

  • locating good die sites and defective die sites of the substrate; and

    storing information for the good die sites and the defective die sites of the substrate in an electronic file for accessing information of at least one good die site on the substrate and for accessing information for at least one defective die site on the substrate for attaching at least one semiconductor die to the substrate to a good die site of the good die sites and attaching a known defective die to a defective die site of the defective die sites.

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