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Molding tool and a method of forming an electronic device package

  • US 20060169490A1
  • Filed: 03/02/2006
  • Published: 08/03/2006
  • Est. Priority Date: 09/16/2003
  • Status: Abandoned Application
First Claim
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1. A molding tool for an electronic device package housing, comprising:

  • a first platen having a first mold cavity including attachment protrusions for sealing against attachment pads of an interposer; and

    a second platen having a second mold cavity including contact protrusions configured to seal against contact pads of the interposer.

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