Molding tool and a method of forming an electronic device package

• US 20060169490A1
• Filed: 03/02/2006
• Published: 08/03/2006
• Est. Priority Date: 09/16/2003
• Status: Abandoned Application

• Current Assignee: Cary J. Baerlocher, Chad A. Cobbley, Steven W. Heppler, Todd O. Bolken
• Original Assignee: Cary J. Baerlocher, Chad A. Cobbley, Steven W. Heppler, Todd O. Bolken
• Inventors: Cobbley, Chad A., Bolken, Todd O., Heppler, Steven W., Baerlocher, Cary J.
• Application Number:
  US11/366,793
• Publication Number:
  US 20060169490A1
• Time in Patent Office: Days
• US Class Current: 174/521
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 21/4803 Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks H01L21/4846 takes precedence; printed circuit boards H05K1/00
• CPC Class Codes: H01L 21/481 Insulating layers on insulating parts, with or without metallisation
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/484 Connecting portions
• CPC Class Codes: H01L 2224/48997 Reinforcing structures
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/10 : characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/28 : Encapsulations, e.g. encapsulating layers, coatings, e.g. for protectionH01L23/552 takes precedence; insulating layers for contacts or interconnections H01L23/5329
• CPC Class Codes: H01L 23/48 : Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/49861 : Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 27/14618 : Containers
• CPC Class Codes: H01L 27/14683 : Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

Claims

1. A molding tool for an electronic device package housing, comprising:

a first platen having a first mold cavity including attachment protrusions for sealing against attachment pads of an interposer; and

a second platen having a second mold cavity including contact protrusions configured to seal against contact pads of the interposer.

2. The molding tool of claim 1, wherein the first mold cavity is configured with a size and a shape to form a housing structure on a chip surface of the interposer.

3. The molding tool of claim 1, further comprising a mold compound within the first mold cavity and the second mold cavity.

4. The molding tool of claim 3, wherein the mold compound comprises a thermoplastic polymer.

5. The molding tool of claim 3, wherein the mold compound comprises one of a thermoset polymer and an epoxy compound.

6. The molding tool of claim 3, further comprising fine silicon particles within the first mold cavity and the second mold cavity.

7. A method of forming an electronic device package comprising:

providing an interposer including a plurality of attachment pads on a first surface thereof and a plurality of contact pads on a second surface thereof;

sealing a first platen of a molding tool against the plurality of attachment pads of the interposer, forming a first mold cavity therein;

sealing a second platen of a molding tool against the plurality of contact pads of the interposer, forming a second mold cavity therein; and

filling the first mold cavity and the second mold cavity with mold compound.

8. The method of claim 7, further comprising at least partially curing the mold compound onto the first surface of the interposer within the molding tool.

9. The method of claim 7, further comprising covering a plurality of edge surfaces of the interposer with the mold compound.

10. The method of claim 9, wherein covering the plurality of edge surfaces comprises:

forming a plurality of protrusions extending from the plurality of edge surfaces;

placing the substrate into a mold cavity such that at least some of the plurality of protrusions provide a space between the plurality of edge surfaces and an interior surface of the mold cavity;

filling the space between the plurality of edge surfaces and the interior surface of the mold cavity with a mold compound; and

at least partially curing the mold compound onto the edge surfaces of the substrate.

11. The method of claim 10, wherein filling the space between the plurality of edge surfaces and the interior surface of the mold cavity comprises filling the spaces between at least one tie bar that connects the interposer to another interposer of another electronic device package.

12. The method of claim 7, wherein sealing a first platen of a molding tool against the plurality of attachment pads comprises sealing a protrusion of a plurality of protrusions of the first platen of a molding tool against each attachment pad of the plurality of attachment pads.

13. The method of claim 7, wherein sealing a second platen of a molding tool against the plurality of contact pads comprises sealing a protrusion of a plurality of protrusions of the second platen of a molding tool against each contact pad of the plurality of contact pads.