Etchant treatment processes for substrate surfaces and chamber surfaces
First Claim
1. A method for forming a silicon-containing material on a substrate surface, comprising:
- positioning a substrate containing a silicon material within a process chamber;
exposing the substrate to an etching gas containing chlorine gas and a silicon source during an etching process;
exposing the substrate to a deposition gas during a deposition process; and
exposing the process chamber to a chamber clean gas containing the chlorine gas and the silicon source during a chamber clean process.
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Accused Products
Abstract
In one embodiment of the invention, a method for finishing or treating a silicon-containing surface is provided which includes removing contaminants and/or smoothing the surface contained on the surface by a slow etch process (e.g., about <100 Å/min). The silicon-containing surface is exposed to an etching gas that contains an etchant and a silicon source. Preferably, the etchant is chlorine gas so that a relatively low temperature (e.g., <800° C.) is used during the process. In another embodiment, a method for etching a silicon-containing surface during a fast etch process (e.g., about >100 Å/min) is provided which includes removing silicon-containing material to form a recess in a source/drain (S/D) area on the substrate. In another embodiment, a method for cleaning a process chamber is provided which includes exposing the interior surfaces with a chamber clean gas that contains an etchant and a silicon source. The chamber clean process limits the etching of quartz and metal surfaces within the process chamber.
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Citations
36 Claims
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1. A method for forming a silicon-containing material on a substrate surface, comprising:
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positioning a substrate containing a silicon material within a process chamber;
exposing the substrate to an etching gas containing chlorine gas and a silicon source during an etching process;
exposing the substrate to a deposition gas during a deposition process; and
exposing the process chamber to a chamber clean gas containing the chlorine gas and the silicon source during a chamber clean process. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for forming a silicon-containing material on a substrate surface, comprising:
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positioning a substrate containing a silicon material within a process chamber;
exposing the substrate to a deposition gas during a deposition process; and
exposing the process chamber to a chamber clean gas containing chlorine gas and a silicon source during a chamber clean process. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A method for forming a silicon-containing material on a substrate surface, comprising:
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positioning a substrate containing a silicon material within a process chamber;
exposing the substrate to an etching gas containing chlorine gas and a silicon source during an etching process;
exposing the substrate to a deposition gas containing the silicon source during an epitaxial deposition process;
removing the substrate from the process chamber; and
exposing the process chamber to a chamber clean gas containing an etchant gas and the silicon source during a chamber clean process. - View Dependent Claims (28, 29, 30)
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31. A method for forming a silicon-containing material on a substrate surface, comprising:
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positioning a substrate containing a silicon material within a process chamber;
exposing the substrate to an etching gas containing chlorine gas and silane during an etching process;
exposing the substrate to a deposition gas containing the chlorine gas and the silane during an epitaxial deposition process;
removing the substrate from the process chamber; and
exposing the process chamber to a chamber clean gas containing the chlorine gas and the silane during a chamber clean process. - View Dependent Claims (32, 33, 34, 35, 36)
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Specification