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Integrated transformer structure and method of fabrication

  • US 20060170527A1
  • Filed: 02/02/2005
  • Published: 08/03/2006
  • Est. Priority Date: 02/02/2005
  • Status: Active Grant
First Claim
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1. A microelectronic assembly, comprising:

  • a die substrate;

    a plurality of electronic components formed in and on the die substrate and connected to one another to form an integrated circuit;

    a first and a second single-turn inductor; and

    a magnetic material electro-magnetically coupling the first and the second single-turn inductor to one another to form a transformer, the transformer being connected to the integrated circuit.

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