Light emitting device and method of making the same

• US 20060171152A1
• Filed: 01/19/2006
• Published: 08/03/2006
• Est. Priority Date: 01/20/2005
• Status: Abandoned Application

• Current Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Original Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Inventors: Yamaguchi, Seiji, Suehiro, Yoshinobu
• Application Number:
  US11/334,745
• Publication Number:
  US 20060171152A1
• Time in Patent Office: Days
• US Class Current: 362/363
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A light emitting device having: a flip-mounting type light emitting element; a substrate on which the light emitting element is mounted, the substrate being of an inorganic material; a sealing portion to seal the light emitting element, the sealing portion being of an inorganic sealing material; an optical-shaped portion formed nearly semispherical, the optical-shaped portion being of the inorganic sealing material; and a phosphor portion formed covering the optical-shaped portion.

Claims

1. A light emitting device, comprising:

a flip-mounting type light emitting element;

a substrate on which the light emitting element is mounted, the substrate comprising an inorganic material;

a sealing portion to seal the light emitting element, the sealing portion comprising an inorganic sealing material;

an optical-shaped portion formed nearly semispherical, the optical-shaped portion comprising the inorganic sealing material; and

a phosphor portion formed covering the optical-shaped portion.

3. The light emitting device according to claim 1, wherein:

the inorganic sealing material comprises a glass material.

4. The light emitting device according to claim 1, wherein:

the phosphor portion comprises an inorganic material and a phosphor.

5. The light emitting device according to claim 4, wherein:

the phosphor portion comprises a thermal expansion coefficient greater than the sealing portion.

6. The light emitting device according to claim 1, wherein:

the phosphor portion comprises a dichroic mirror that a plurality of materials with different refractive indexes are alternately laminated, and a phosphor layer formed on the dichroic mirror.

7. The light emitting device according to claim 1, wherein:

the phosphor portion comprises a low-melting fluoride glass.

8. The light emitting device according to claim 1, wherein:

the optical-shaped portion comprises a dimension to define a ratio to a width of the light emitting element of 2^1/2 or more and 10 or less.

2. A light emitting device, comprising:

a flip-mounting type light emitting element;

a substrate on which the light emitting element is mounted, the substrate comprising an inorganic material;

a sealing portion to seal the light emitting element, the sealing portion comprising an inorganic sealing material;

an optical-shaped portion formed nearly semispherical, the optical-shaped portion comprising the inorganic sealing material; and

a phosphor portion formed covering the optical-shaped portion,

wherein the inorganic material comprises a thermal expansion coefficient equivalent to that of the light emitting element, and

the inorganic sealing material comprises a thermal expansion coefficient equivalent to that of the substrate and the light emitting element.

9. A light emitting device, comprising:

a light emitting element;

a substrate on which the light emitting element is mounted, the substrate comprising an inorganic material;

a sealing portion to seal the light emitting element, the sealing portion comprising an inorganic sealing material; and

a coating portion formed covering the sealing portion,

wherein the sealing portion comprises a cutting face at which an interface of the inorganic sealing material and the substrate is exposed and by which the light emitting element is surrounded, and

the sealing portion is covered with the coating portion on an entire surface thereof.

11. The light emitting device according to claim 9, wherein:

the light emitting element comprises a flip-mounting type light emitting element, and

the substrate comprises the inorganic material that comprises a thermal expansion coefficient equivalent to that of the sealing portion.

12. The light emitting device according to claim 9, wherein:

the coating portion comprises a light-transmitting inorganic material.

13. The light emitting device according to claim 9, wherein:

the coating portion comprises a phosphor-containing material.

14. The light emitting device according to claim 13, wherein:

the coating portion comprises a dichroic mirror.

10. A light emitting device, comprising:

a light emitting element;

a substrate on which the light emitting element is mounted, the substrate comprising an inorganic material;

a sealing portion to seal the light emitting element, the sealing portion comprising an inorganic sealing material; and

a coating portion formed covering the sealing portion,

wherein the sealing portion comprises a cutting face by which the light emitting element is surrounded, and

the sealing portion is covered with the coating portion on an entire surface thereof that light emitted from the light emitting element reaches directly.

15. A method of making a light emitting device, comprising:

a first step that a substrate comprising an inorganic material is provided;

a second stet that a plurality of light emitting elements are mounted on the substrate;

a third step that the substrate with the plurality of light emitting elements mounted thereon is sealed with a sealing material;

a fourth step that a cutting portion is provided in the sealing material;

a fifth step that a coating is formed on a surface of the sealing material including an exposed portion formed by providing the cutting portion; and

a sixth step that the substrate with the sealing material is separated along the cutting potion.

16. The method according to claim 15, wherein:

the coating in the fifth step is formed by sputtering.

17. The method according to claim 15, wherein:

the coating in the fifth step is formed by electrostatic coating.