Wood flooring composed of wpl, base and soundproof layer

• US 20060172118A1
• Filed: 09/30/2003
• Published: 08/03/2006
• Est. Priority Date: 05/06/2003
• Status: Active Grant

• Current Assignee: LG Chem Limited (LG Corporation)
• Original Assignee: LG Chem Limited (LG Corporation)
• Inventors: Jeong, Byeong-Roh, Han, Kie-Sun, Kim, Byeong-Hoe, Min, Il-Hong
• Granted Patent: US 7,473,457 B2
• Time in Patent Office: Days
• US Class Current: 428/156
• CPC Class Codes: B27N 7/005 Coating boards, e.g. with a finishing or decorating layer
• CPC Class Codes: B32B 21/02 the layer being formed of fibres, chips, or particles , e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
• CPC Class Codes: B32B 21/06 of paper or cardboard
• CPC Class Codes: B32B 21/08 of synthetic resin
• CPC Class Codes: B32B 21/14 comprising wood board or veneer
• CPC Class Codes: B32B 2255/08 on wood layer
• CPC Class Codes: B32B 2255/26 Polymeric coating
• CPC Class Codes: B32B 2260/026 Wood layer
• CPC Class Codes: B32B 2260/028 Paper layer
• CPC Class Codes: B32B 2260/046 Synthetic resin
• CPC Class Codes: B32B 2307/102 Insulating
• CPC Class Codes: B32B 2307/558 Impact strength, toughness
• CPC Class Codes: B32B 2307/584 Scratch resistance
• CPC Class Codes: B32B 2419/04 Tiles for floors or walls tiles for roofs B32B2419/06
• CPC Class Codes: B32B 27/04 as impregnant, bonding, or embedding substance not used
• CPC Class Codes: E04F 15/02 Flooring or floor layers composed of a number of similar elements of webs E04F15/16
• CPC Class Codes: E04F 15/181 Insulating layers integrally formed with the flooring or the flooring elements
• CPC Class Codes: E04F 15/20 for sound insulation
• CPC Class Codes: E04F 15/206 Layered panels for sound insulation
• CPC Class Codes: E04F 2290/023 for heating
• CPC Class Codes: E04F 2290/042 : with a facing or top layer for sound insulation
• CPC Class Codes: E04F 2290/043 : with a bottom layer for sound insulation
• CPC Class Codes: F24D 13/02 : solely using resistance heating, e.g. underfloor heating
• CPC Class Codes: F24D 3/142 : integrated in prefab construction elements
• CPC Class Codes: Y02B 30/00 : Energy efficient heating, ventilation or air conditioning [HVAC]
• CPC Class Codes: Y10T 428/24479 : including variation in thickness
• CPC Class Codes: Y10T 428/2457 : Parallel ribs and/or grooves
• CPC Class Codes: Y10T 428/24612 : Composite web or sheet
• CPC Class Codes: Y10T 428/31982 : Wood or paper
• CPC Class Codes: Y10T 428/31989 : Of wood
• CPC Class Codes: Y10T 428/31993 : Of paper

Abstract

Disclosed herein is a back-grooved laminate wood flooring in which a wood veneer of high pressure resin impregnation laminate (WPL) is laminated on a base selected from a vinyl chloride (PVC) resin layer, on oriented strand board (OSB), a high-density fiberboard (HDF) and a waterproof plywood. More specifically, the back-grooved laminate wood flooring comprises a WPL (20), an adhesive layer (40) and a base (10) (a polyvinyl chloride resin layer, OSB, HDF or waterproof plywood) wherein the WPL (20) includes a base-reinforcing layer (24), a natural veneer layer (23), a resin-impregnated overlay layer (22) and a surface UV coating layer (21) layered in this order from the bottom. The back-grooved laminate wood flooring further exhibits excellent soundproofing performance.

Claims

1. A laminate wood flooring for an under-floor heating system comprising a wood veneer of high pressure resin impregnation laminate (WPL), an adhesive layer and a base,

wherein the WPL includes a base-reinforcing layer impregnated in a phenol resin, a resin-impregnated or not impregnated natural veneer layer, a resin-impregnated overlay layer and a UV or primer-treated UV coating layer layered in this order from the bottom, the base-reinforcing layer being made of at least one material selected from a high-density fiberboard, a kraft paper and a shielding paper,

the base is back-grooved, and is selected from a polyvinyl chloride resin layer, an oriented strand board (OSB), a high-density fiberboard (HDF) and a waterproof plywood, and

the WPL and the base are adhered to each other by the adhesive layer.

2. The laminate wood flooring for an under-floor heating system according to claim 1, wherein the resin-impregnated natural veneer layer is produced by cutting natural raw lumber to a natural veneer having a thickness of 0.3˜

5 mm, and dipping the cut natural veneer in a resin or impregnating a resin into the natural veneer under reduced pressure, the resin being selected from urea, urea-melamine, melamine, phenol, acryl, polyester, unsaturated polyester, epoxy, polyvinyl acetate and urethane resins and used in an amount of 30˜

150% by weight, based on the weight of the natural veneer.

3. The laminate wood flooring for an under-floor heating system according to claim 1, wherein the resin-impregnated overlay layer is produced by impregnating an overlay paper in a resin selected from urea, urea-melamine, melamine, phenol, acryl, polyester, unsaturated polyester, epoxy, polyvinyl acetate and urethane resins in an amount of 150˜

300% by weight, based on the weight of the overlay paper, the overlay paper being prepared by uniformly distributing wear-resistant silica or alumina particles in a cellulose paper having a basis weight of 20˜

100 g/m².

4. The laminate wood flooring for an under-floor heating system according to claim 1, wherein the base-reinforcing layer made of shielding paper is produced by impregnating a cellulose wood-free paper having a basis weight of 50˜

150 g/m² in a transparent phenol resin, and the base-reinforcing layer made of kraft paper is produced by impregnating a kraft paper having a basis weight of 80˜

300 g/m² in a transparent phenol resin.

5. The laminate wood flooring for an under-floor heating system according to claim 4, wherein two or more sheets of the resin-impregnated shielding paper, high-density fiberboard or kraft paper are alternatively used depending on the desired thickness.

6. The laminate wood flooring for an under-floor heating system according to claim 1, wherein the resin-impregnated overlay layer is produced by impregnating an overlay paper in an amino resin selected from urea, urea-melamine and melamine resins, and is coated with a urethane primer and UV light treatment.

7. The laminate wood flooring for an under-floor heating system according to any one of claims 1 to 6, further comprising at least one soundproof layer laminated in at least one position selected from (a) between the WPL and the base and (b) under the base.

8. The laminate wood flooring for an under-floor heating system according to claim 7, wherein the soundproof layer is made of a polymer selected from polyvinylchloride (PVC), polyethylene (PE), ethylene vinyl acetate (EVA), polypropylene (PP), polyurethane (PU), polyester, non-woven fabrics, chloroprene rubber (CR) and acrylonitrile butadiene rubber (NBR), and the surface of the soundproof layer is processed by a chemical crosslinking and foaming process or a high-pressure foaming process including an embossing and intaglio technique.