Process condition sensing wafer and data analysis system
First Claim
1. A system for sensing processing conditions comprising:
- a substrate;
a plurality of sensors attached to the substrate;
an electronics platform electrically coupled to the plurality of sensors;
the electronics platform having an enclosure that encloses at least one integrated circuit, the enclosure including a thermally insulating volume; and
the electronics platform mounted to the substrate by one or more legs that elevate the platform from the substrate.
2 Assignments
0 Petitions
Accused Products
Abstract
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. Isolation may be provided by vacuum or suitable material and phase change material may be located adjacent to electronics to maintain a low temperature.
-
Citations
24 Claims
-
1. A system for sensing processing conditions comprising:
-
a substrate;
a plurality of sensors attached to the substrate;
an electronics platform electrically coupled to the plurality of sensors;
the electronics platform having an enclosure that encloses at least one integrated circuit, the enclosure including a thermally insulating volume; and
the electronics platform mounted to the substrate by one or more legs that elevate the platform from the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A system for sensing processing conditions comprising:
-
a substrate;
a plurality of sensors attached to the substrate;
an electronics platform electrically coupled to the plurality of sensors;
the electronics platform having an enclosure that encloses at least one integrated circuit, the enclosure including a phase change material having a melting point between 20 and 85 degrees Centigrade; and
the electronics platform mounted to the substrate by one or more legs that elevate the platform from the substrate. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
-
-
18. A method of forming a process condition measuring device comprising:
-
attaching sensors to a substrate and connecting the sensors to an electronics module by leads; and
forming the electronics module to include an enclosure that encloses an insulating volume around electronic components, the enclosure distanced from the substrate by legs. - View Dependent Claims (19, 20, 21, 22, 23, 24)
-
Specification