Heat dispensing device

• US 20060175046A1
• Filed: 02/09/2005
• Published: 08/10/2006
• Est. Priority Date: 02/09/2005
• Status: Abandoned Application

• Current Assignee: Egbon Electronics Ltd.
• Original Assignee: Egbon Electronics Ltd.
• Inventors: Chen, Wan-Tien
• Application Number:
  US11/053,255
• Publication Number:
  US 20060175046A1
• Time in Patent Office: Days
• US Class Current: 165/104.330
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dispensing device includes a tubular body with a contact end and a dispensing end. A plurality of fins is integrally connected on outside of the dispensing end so as to increase the area for dispensing heat. The heat is absorbed from the contact end and quickly and directly conducted to the dispensing end to have an optimal efficiency for removing heat from a heat source.

Claims

1. A heat dispensing device for using on an electronic device comprising:

a tubular body made of a material with high heat conductivity, said body having a contact end in contact with a high temperature portion of the electronic device and a dispensing end having an outside surface including a plurality of curved fins extending from said outside surface and each curved fin formed integrally on the dispensing end of the body, so that heat generated by the electronic device is transferred to the dispensing end via the contact end of the body and wherein the curved fins have the same curvature and are located at equal distances from one another.

2. The device as claimed in claim 1, wherein the contact end of the body is a flat board.

3. The device as claimed in claim 1, wherein the contact end of the body is bent into an S-shaped end.

4. The device as claimed in claim 1, wherein the fins are made within one-step of machining process.

5. The device as claimed in claim 1, wherein the fins are made by the way of chip formation, or formed directly by cutting the surface of the body.

6. The device as claimed in claim 1, wherein the body is a vacuum pipe having working fluid therein.