INTEGRATED CIRCUIT PACKAGE SYSTEM USING INTERPOSER
First Claim
Patent Images
1. An integrated circuit package system comprising:
- forming an interposer of predetermined thickness;
removing a portion from the interposer to form a cavity;
forming one or more contacts around the central cavity on the interposer; and
employing the interposer for connecting first and second packages.
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Accused Products
Abstract
An integrated circuit package system is provided in which an interposer of predetermined thickness is formed. A central portion of the interposer is removed, thereby forming a cavity. Additionally, one or more contacts are formed around the central cavity on the interposer. The interposer is employed for connecting first and second packages.
67 Citations
20 Claims
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1. An integrated circuit package system comprising:
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forming an interposer of predetermined thickness;
removing a portion from the interposer to form a cavity;
forming one or more contacts around the central cavity on the interposer; and
employing the interposer for connecting first and second packages. - View Dependent Claims (2, 3, 4, 5)
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6. An integrated circuit package system comprising:
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forming a bottom package with a mold portion;
forming an interposer over the bottom package with a central cavity and one or more electrical interconnections for electrically interconnecting the bottom package and a top package through the interposer; and
forming the top package over the interposer. - View Dependent Claims (7, 8, 9, 10)
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11. An integrated circuit package system comprising:
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an interposer with a cavity and predetermined thickness for connecting first and second packages; and
one or more contacts formed around the cavity. - View Dependent Claims (12, 13, 15)
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14. The system of claim 111 further comprising:
one or more epoxy mold compounds selected from the group consisting of normal and fine filler sizes on at least one side of the interposer.
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16. An integrated circuit package system comprising:
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a bottom package with a mold portion;
a top package;
an interposer with a central cavity between the bottom package and the top package, the interposer for electrically interconnecting the bottom package and top package by one or more contacts around the central cavity and connected through the interposer. - View Dependent Claims (17, 18, 19, 20)
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Specification