Optical scanner package and method of manufacturing the same

• US 20060176539A1
• Filed: 02/03/2006
• Published: 08/10/2006
• Est. Priority Date: 02/07/2005
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Mun, Yong-kweun, Ko, Young-chul, Choi, Won-kyoung
• Application Number:
  US11/346,277
• Publication Number:
  US 20060176539A1
• Time in Patent Office: Days
• US Class Current: 359/226.100
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81B 2203/0384 sloped profile
• CPC Class Codes: B81B 7/0067 for controlling the passage of optical signals through the package
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

Provided are a chip-scale optical scanner package with reduced noise, and a method of manufacturing the optical scanner package. The optical scanner package includes: an optical scanner device scanning an incident beam, the optical scanner device including a mirror portion, comb-electrode structures rotating the mirror portion, and a base substrate; and a cover glass protecting the mirror portion, the cover glass including support portions sealingly adhered to a top surface of the base substrate around the mirror portion and a transmission portion with first and second transmission surfaces formed on the support portions and sloped with respect to a top surface of the base substrate. Accordingly, the optical scanner package can be miniaturized, can be simply processed, and reduce packaging costs. Further, the brightness and contrast of an image can be enhanced, and background noise can be reduced by reducing a sub reflected beam that causes noise.

Claims

1. An optical scanner package comprising:

an optical scanner device scanning an incident beam, the optical scanner device including a mirror portion, comb-electrode structures rotating the mirror portion, and a base substrate; and

a cover glass protecting the mirror portion, the cover glass including support portions sealingly adhered to a top surface of the base substrate around the mirror portion and a transmission portion with first and second transmission surfaces formed on the support portions and sloped with respect to a top surface of the base substrate.

2. The optical scanner package of claim 1, wherein the slope between the first and second transmission surfaces and the base substrate is greater than a maximum rotation angle of the mirror portion.

3. The optical scanner package of claim 1, wherein an anti-reflection layer is formed on the first transmission surface and/or the second transmission surface.

4. The optical scanner package of claim 1, further comprising an absorption layer formed at portions of the first transmission surface and/or the second transmission surface not covered by a transmission area.

5. The optical scanner package of claim 1, wherein through-holes in which a conductive metal delivering voltage for rotating the mirror portion are formed in the base substrate.

6. A method of manufacturing an optical scanner package, comprising:

forming an optical scanner device by stacking a mirror portion and comb-electrode structures for rotating the mirror portion on a wafer that forms a base substrate;

forming a cavity so that the optical scanner device can include support portions installed on a top surface of the base substrate around the mirror portion and a transmission portion with first and second transmission surfaces formed on the support portions, and processing a cover glass by making the thickness at one side of the support portions less than the thickness at the other side of the support portions so that the first and second transmission surfaces can be sloped with respect to the top surface of the base substrate; and

hermetically sealing the mirror portion in a chip scale by adhering the top surface of the base substrate to bottom surfaces of the support portions.

7. The method of claim 6, wherein the forming of the optical scanner device comprises cutting the wafer in columns, the wafer being arranged in a matrix form.

8. The method of claim 6, wherein the processing of the cover glass comprises:

planarizing and polishing both surfaces of a glass wafer;

forming a plurality of cavities arranged in a matrix form at the bottom surface of the glass wafer;

cutting the glass wafer in columns and preparing a glass bar; and

cutting and polishing a bottom surface of the glass bar by making a thickness at one side of the support portions less than a thickness at the other side of the support portions so that the slope between the transmission surfaces and the top surface of the base substrate is greater than a maximum rotation angle of the mirror portion.

9. The method of claim 6, wherein the processing of the cover glass comprises forming an anti-reflection layer on a top surface and/or a bottom surface of the cover glass.

10. The method of claim 6, wherein the processing of the cover glass comprises forming an absorption layer at an edge of a top surface and/or a bottom surface of the cover glass.

11. The method of claim 6, wherein the hermetically sealing of the mirror portion comprises eutectic-bonding the cover glass and the optical scanner device in a wafer bar shape.