Method of forming a ruthenium thin film using a plasma enhanced atomic layer deposition apparatus and the method thereof

• US 20060177601A1
• Filed: 02/10/2005
• Published: 08/10/2006
• Est. Priority Date: 02/10/2005
• Status: Abandoned Application

• Current Assignee: Asm Genitech Korea Ltd. (ASM International NV)
• Original Assignee: Asm Genitech Korea Ltd. (ASM International NV)
• Inventors: Park, Hyung-Sang, Kang, Sang-Won
• Application Number:
  US11/056,487
• Publication Number:
  US 20060177601A1
• Time in Patent Office: Days
• US Class Current: 427/576
• CPC Class Codes: C23C 16/18 from metallo-organic compounds
• CPC Class Codes: C23C 16/45542 Plasma being used non-continuously during the ALD reactions
• CPC Class Codes: C23C 16/45553 characterized by the use of precursors specially adapted for ALD
• CPC Class Codes: C23C 16/50 using electric discharges generation and control of plasma in discharge tubes for surface treatment H01J37/32, H01J37/34

Abstract

A method of depositing a ruthenium(Ru) thin film by using readily available ruthenium precursors such as Ru(CP)₂ and Ru(EtCP)₂, ammonia gas(NH₃) as a reactant gas or a purge gas or both, and a plasma enhanced atomic layer deposition(PEALD) apparatus and the method thereof, according to the present invention, is disclosed. Also a gas mixture of nitrogen gas(N₂) and hydrogen(H₂) is used as a reactant gas or a purge gas or both in addition to ammonia gas in depositing a ruthenium thin film according to the present invention. A ruthenium(Ru) thin film of high density, very pure, very smooth on the film surface and uniform is deposited even at the temperature of the reaction chamber below 400° C. using ammonia gas and a gas mixture of nitrogen gas and hydrogen gas, respectively, as a reactant gas under plasma.

Claims

1. A method of depositing a ruthenium(Ru) thin film on a substrate in a reaction chamber by using a plasma enhanced atomic layer deposition(PEALD) method, comprising;

supplying a ruthenium precursor gas having the structure of the form Ru(XaXb) into the reaction chamber so that the ruthenium precursor gas is adsorbed onto the surface of the substrate, where Xa and Xb are, respectively, any one of cyclopentadienyl(Cp), methylcyclopentadienyl (MeCp), ethylcyclopentadiennyl(EtCp) and isopropylcyclopentadienyl(i-PrCp); and

generating ammonia plasma in the reaction chamber by supplying ammonia gas into the reaction chamber and then generating plasma in the reaction chamber or supplying plasma-activated ammonia gas into the reaction chamber so that a reaction between the ruthenium precursor adsorbed onto the surface of the substrate and the ammonia gas activated by plasma takes place in the reaction chamber, thereby a ruthenium thin film is deposited on the surface of the substrate.

2. The method of claim 1, further comprising:

repeating the process steps until a ruthenium thin film is formed to a desired thickness with or without purging the reaction chamber with an inert gas after supplying the ruthenium precursor gas.

3. The method of claim 2, wherein the inert gas is ammonia gas(NH₃) without activation by plasma.

4. The method of claim 1, further comprising:

repeating the process steps until a ruthenium thin film is formed to a desired thickness with or without purging the reaction chamber with an inert gas after the plasma period.

5. The method of claim 4, wherein the inert gas is ammonia gas(NH₃) without activation by plasma.

6. The method of claim 1, wherein before a ruthenium precursor gas is supplied to the reaction chamber the reaction chamber is purged with an inert gas.

7. The method of claim 6, wherein the inert gas is ammonia gas(NH₃) without activation by plasma.

8. The method of claim 1, wherein after a ruthenium precursor is supplied to the reaction chamber, ammonia gas(NH₃) is supplied to the reaction chamber and at the same time plasma is generated in synchronization with the supply period of the ammonia gas(NH₃) so that a reaction between the ruthenium precursor adsorbed onto the surface of the substrate and the ammonia gas(NH₃) activated by plasma takes place, thereby a ruthenium thin film is deposited on the substrate.

9. The method of claim 1, wherein the inside temperature of the reaction chamber is in the range from 100°

C. to 400°

C.

10. The method of claim 1, wherein the ruthenium precursor is Ru(EtCp)₂, the inside temperature of the reaction chamber is in the range from 100°

C. to 400°

C., the reaction chamber pressure is in the range from 0.01 to 50 torr, ammonia gas(NH₃) is supplied into the reaction chamber and then plasma is generated in the reaction chamber so that a reaction between the ruthenium precursor adsorbed onto the surface of the substrate and the ammonia gas(NH₃) activated by plasma takes place in the reaction chamber, thereby a ruthenium thin film is deposited on the substrate.

11. The method of claim 10, wherein the ruthenium precursor gas is supplied into the reaction chamber for the time duration between 0.02 and 20 seconds.

12. The method of claim 10, wherein after supplying the ruthenium precursor gas to the reaction chamber, the reaction chamber is purged with an inert gas for the time duration between 0.1 and 10 seconds.

13. The method of claim 12, wherein the inert gas is ammonia gas(NH₃) without activation by plasma.

14. The method of claim 10, wherein plasma is generated in the reaction chamber for the time duration between 0.02 and 10 seconds.

15. A method of depositing a ruthenium thin film on the surface of a substrate in a reaction chamber by using a plasma enhanced atomic layer deposition(PEALD) method, comprising;

supplying a ruthenium precursor gas having the structure of the form Ru(XaXb) into the reaction chamber so that the ruthenium precursor gas is adsorbed onto the surface of the substrate, where Xa and Xb are, resprctively, any one of cyclopentadienyl(Cp), methylcyclopentadienyl (MeCp), ethylcyclopentadiennyl(EtCp) and isopropylcyclopentadienyl(i-PrCp); and

generating the mixed gas plasma of nitrogen gas(N₂) and hydrogen gas(H₂) in the reaction chamber by supplying a gas mixture of nitrogen gas(N₂) and hydrogen gas(H₂) to the reaction chamber and then generating plasma in the reaction chamber or supplying plasma-activated gas mixture of nitrogen gas(N₂) and hydrogen gas(H₂) into the reaction chamber so that a reaction between the ruthenium precursor adsorbed onto the surface of the substrate and the gas mixture activated by plasma takes place in the reaction chamber, thereby a ruthenium thin film is deposited on the substrate.

16. The method of claim 15, further comprising:

repeating the process steps until a ruthenium thin film is formed to a desired thickness with or without purging the reaction chamber with an inert gas after the ruthenium precursor gas is supplied.

17. The method of claim 16, wherein the purge gas is the gas mixture of nitrogen gas(N₂) and hydrogen gas(H₂) without activation by plasma.

18. The method of claim 15, further comprising:

repeating the process steps until a ruthenium thin film is formed to a desired thickness with or without purging the reaction chamber with an inert gas after the plasma generation period.

19. The method of claim 18, wherein the purge gas is the gas mixture of nitrogen gas(N₂) and hydrogen gas(H₂) without activation by plasma.

20. The method of claim 15, wherein a gas mixture of nitrogen gas(N₂) and hydrogen gas(H₂) is supplied to the reaction chamber and at the same time plasma is generated in synchronization with the supply period of the gas mixture of nitrogen gas(N₂) and hydrogen gas(H₂).

21. The method of claim 15, wherein the inside temperature of the reaction chamber is in the range from 100°

C. to 400°

C.

22. The method of claim 15, wherein the ruthenium precursor gas is Ru(EtCp)₂, the inside temperature of the reaction chamber is in the range from 100°

C. to 400°

C., the reaction chamber pressure is in the range from 0.01 to 50 torr, a gas mixture of nitrogen gas(N₂) and hydrogen gas(H₂) is supplied into the reactor and then plasma is generated in the reaction chamber so that a reaction between the ruthenium precursor adsorbed onto the surface of the substrate and the gas mixture of nitrogen gas(N₂) and hydrogen gas(H₂) activated by plasma takes place in the reaction chamber, thereby a ruthenium thin film is deposited on the substrate.

23. The method of claim 22, wherein the ruthenium precursor gas is supplied into the reaction chamber for the time duration between 0.02 and 20 seconds.

24. The method of claim 22, wherein after supplying the ruthenium precursor gas into the reaction chamber, the reaction chamber is purged with an inert gas for the time duration between 0.1 and 10 seconds.

25. The method of claim 24, wherein the purge gas is the gas mixture of nitrogen gas(N₂) and hydrogen gas(H₂) without activation by plasma.

26. The method of claim 22, wherein plasma is generated in the reaction chamber for the time duration between 0.02 and 10 seconds.

27. A method of depositing a ruthenium(Ru) thin film on the surface of a substrate in a reaction chamber by using a plasma enhanced atomic layer deposition(PEALD) method, comprising;

supplying a ruthenium precursor gas having the structure of the form Ru(XaXb) into the reaction chamber so that the ruthenium precursor gas is adsorbed onto the surface of the substrate, where Xa and Xb are, respectively, any one of cyclopentadienyl(Cp), methylcyclopentadienyl (MeCp), ethylcyclopentadiennyl(EtCp) and isopropylcyclopentadienyl(i-PrCp); and

supplying ammonia gas(NH₃) into the reaction chamber to purge the reaction chamber; and

generating plasma in the reaction chamber while the ammonia gas(NH₃) is continuously flown through the reaction chamber so that a reaction between the ruthenium precursor adsorbed onto the surface of the substrate and the ammonia gas(NH₃) activated by plasma takes place in the reaction chamber, thereby a ruthenium thin film is deposited on the surface of the substrate.

28. The method of claim 27, wherein the inside temperature of the reaction chamber is between 100°

C. and 400°

C.

29. The method of claim 27, further comprising:

repeating the process steps until a ruthenium thin film is formed to a desired thickness with or without purging the reaction chamber after the plasma generation period either by continuously flowing ammonia gas through the reaction chamber or by supplying an inert gas into the reaction chamber.

30. A method of depositing a ruthenium(Ru) thin film on the surface of a substrate in a reaction chamber by using a plasma enhanced atomic layer deposition(PEALD) method, comprising;

supplying a ruthenium precursor gas having the structure of the form Ru(XaXb) into the reaction chamber so that the ruthenium precursor gas is adsorbed onto the surface of the substrate, where Xa and Xb are, resprctively, any one of cyclopentadienyl(Cp), methylcyclopentadienyl (MeCp), ethylcyclopentadiennyl(EtCp) and isopropylcyclopentadienyl(i-PrCp); and

supplying a gas mixture of nitrogen gas(N₂) and hydrogen gas(H₂) into the reaction chamber to purge the reaction chamber; and

generating plasma in the reaction chamber while the gas mixture of nitrogen gas(N₂) and hydrogen gas(H₂) is continuously flown through the reaction chamber so that a reaction between the ruthenium precursor adsorbed onto the surface of the substrate and the gas mixture of nitrogen gas(N₂) and hydrogen gas(H₂) activated by plasma takes place in the reaction chamber, thereby a ruthenium thin film is deposited on the surface of the substrate.

31. The method of claim 30, wherein the inside temperature of the reaction chamber is between 100°

C. and 400°

C.

32. The method of claim 30, further comprising:

repeating the process steps until a ruthenium thin film is formed to a desired thickness with or without purging the reaction chamber after the plasma generation period either by continuously flowing the gas mixture of nitrogen gas(N₂) and hydrogen gas(H₂) through the reaction chamber or by supplying an inert gas into the reaction chamber.