METHODS FOR FORMING THIN OXIDE LAYERS ON SEMICONDUCTOR WAFERS

• US 20060177987A1
• Filed: 03/31/2006
• Published: 08/10/2006
• Est. Priority Date: 05/09/1997
• Status: Abandoned Application

• Current Assignee: Semitool Incorporated (Applied Materials Incorporated)
• Original Assignee: Semitool Incorporated (Applied Materials Incorporated)
• Inventors: Bergman, Eric J.
• Application Number:
  US11/278,184
• Publication Number:
  US 20060177987A1
• Time in Patent Office: Days
• US Class Current: 438/396
• CPC Class Codes: B81C 1/00547 Etching processes not provided for in groups B81C1/00531 - B81C1/00539
• CPC Class Codes: H01L 21/02049 with gaseous HF
• CPC Class Codes: H01L 21/02052 Wet cleaning only H01L21/02085 takes precedence
• CPC Class Codes: H01L 21/02238 silicon in uncombined form, i.e. pure silicon
• CPC Class Codes: H01L 21/02307 treatment by exposure to a liquid
• CPC Class Codes: H01L 21/02312 treatment by exposure to a gas or vapour
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/31111 by chemical means
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/31662 of silicon in uncombined form
• CPC Class Codes: H01L 21/6708 using mainly spraying means, e.g. nozzles

Abstract

An oxide layer on a silicon wafer may be removed by applying a process chemical such as hydrofluoric acid to the wafer. This will typically remove substantially all of the existing oxide layer, leaving a bare silicon surface. A high quality self-terminating chemical oxide layer may then be grown on the wafer. The chemical oxide layer is then chemically etched to achieve a thinned oxide layer. A layer of material, which may be a high-K dielectric material, is than applied onto the thinned oxide layer. Microelectronic devices having improved electrical characteristics can be manufactured using this process.

Claims

1. A method for forming an oxide layer on a silicon wafer, comprising:

A] applying a first fluorinated process reagent to the wafer, with the fluorinated process agent acting to remove silicon dioxide from the wafer;

B] growing a self-terminating chemical oxide layer on the wafer;

C] applying a second fluorinated process reagent to the chemical oxide layer on the wafer to reduce the thickness of the chemical oxide layer; and

D] applying a layer of material over the chemical oxide layer.

2. The method of claim 1 wherein one or both of the first and second fluorinated process reagents comprises HF.

3. The method of claim 2 wherein one or both of the first and second fluorinated process reagents comprises HF liquid, vapor or plasma.

4. The method of claim 2 wherein one or both of the first and second fluorinated process reagent comprises ammonium fluoride.

5. The method of claim 2 wherein one or both of the first fluorinated process reagents is sprayed onto the wafer.

6. The method of claim 2 wherein one of both of the first fluorinated process reagents is applied by immersing the wafer into a liquid bath of the first fluorinated process reagent.

7. The method of claim 1 wherein the self-terminating chemical oxide layer on the wafer is grown in a controlled environment.

8. The method of claim 7 wherein the controlled environment comprises a process chamber, with dry ozone gas provided into the process chamber.

9. The method of claim 7 wherein the controlled environment comprises a process chamber, with ozone gas provided into the process chamber with de-ionized water.

10. The method of claim 9 wherein the ozone gas is dissolved or entrained in the water.

11. The method of claim 9 with dry ozone gas provided into the process chamber and diffusing through a layer of liquid, including de-ionized water, on the wafer surface.

12. The method of claim 7 wherein the controlled environment comprises a process chamber, with an oxidizer provided into the process chamber.

13. The method of claim 12 wherein the oxidizer comprises hydrogen peroxide or an oxidizing acid.

14. The method of claim 1 wherein the second fluorinated process reagent comprises HF and a liquid selected from the group consisting of de-ionized water, ascetic acid and an alcohol.

15. The method of claim 1 wherein the second fluorinated process reagent etches the oxide layer at an etch rate of from about 0.5 to 5 angstroms per minute.

16. The method of claim 1 wherein the second fluorinated process reagent is applied for an empirically determined time interval.

17. The method of claim 1 wherein the layer of material comprises a high-K dielectric material.

18. The method of claim 17 wherein the high-K dielectric material comprises a member selected from the group consisting of hafnium, hafnium silicon oxide, lanthanum oxide, lanthanum aluminum oxide, zirconium oxide, zirconium silicon oxide, titanium oxide, tantalum oxide, barium strontium titanium oxide, barium titanium oxide, strontium titanium oxide, yttrium oxide, aluminum oxide, lead scandium tantalum oxide, and lead zinc niobate.

19. A method for forming a reduced thickness oxide layer on a silicon wafer having an initial self terminating native, thermal or chemical oxide layer, comprising:

determining the thickness of the initial oxide layer on the wafer;

applying a fluorinated process reagent to the initial oxide layer on the wafer for a time interval sufficient to thin the initial oxide layer by a desired amount; and

applying a layer of material onto the thinned oxide layer.

20. The method of claim 19 wherein the thickness of the initial oxide layer is determined by allowing the wafer to grow a native oxide layer having a known terminal thickness.

21. The method of claim 19 wherein the thickness of the initial oxide layer is determined by measuring.

22. The method of claim 19 wherein the thickness of the initial oxide layer is provided by the wafer manufacturer.

23. The method of claim 19 wherein the time interval is empirically selected.

24. The method of claim 19 wherein the layer of material is applied within 24 hours of thinning the initial oxide layer.

25. The method of claim 19 further comprising storing the wafer in a non-oxidizing environment after thinning the initial oxide layer and before applying the layer of material to the thinned initial oxide layer.

26. A method of manufacturing a microelectronic device on a silicon wafer comprising:

applying a first fluorinated process reagent to the wafer, with the fluorinated process agent acting to remove a silicon dioxide film, having a thickness T1, from the wafer;

growing a self-terminating chemical oxide layer on the wafer by exposing the wafer to an oxidizer;

applying a second fluorinated process reagent to the chemical oxide layer on the wafer, with the second fluorinated process reagent etching the chemical oxide layer down to a thickness T2, with T2 less than T1; and

applying a high-K dielectric material on the chemical oxide layer.