Communication device

• US 20060178118A1
• Filed: 12/22/2005
• Published: 08/10/2006
• Est. Priority Date: 02/10/2005
• Status: Abandoned Application

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Yoshida, Hideo, Inobe, Hiroyuki, Kajihara, Sunao
• Application Number:
  US11/313,789
• Publication Number:
  US 20060178118A1
• Time in Patent Office: Days
• US Class Current: 455/90.300
• CPC Class Codes: E05D 11/0081 for transmitting energy, e.g. electrical cable routing
• CPC Class Codes: E05Y 2900/606 for electronic devices

Abstract

A communication device includes a first housing having a first substrate and a second housing having a second substrate, wherein the first substrate and the second substrate are connected by a signal wire including a plurality of thin electric wires, each of which is made of a conductor covered with an insulator, the plurality of thin electric wires forming the signal wire are tied in a bundle at a center portion except the ends thereof and covered with a ground wire mesh made of a plurality of conductive wires knitted into a mesh structure and the ends of the ground wire mesh are connected to the first substrate and the second substrate, respectively.

Claims

1. A communication device comprising a first housing having a first substrate and a second housing having a second substrate, wherein

the first substrate and the second substrate are connected by a signal wire including a plurality of thin electric wires, each of which is made of a conductor covered with an insulator,

the plurality of thin electric wires forming the signal wire are tied in a bundle at a center portion except the ends thereof and covered with a ground wire mesh made of a plurality of conductive wires knitted into a mesh structure and

the ends of the ground wire mesh are connected to the first substrate and the second substrate, respectively.

2. A communication device according to claim 1, wherein

each of the conductive wires for forming the ground wire mesh is made of a resin thread covered with copper foil.

3. A communication device according to claim 1, wherein

the first housing and the second housing are connected by a hinge to be freely opened and closed by rotating on an open/close axis of the hinge,

a through hole having the open/close axis as the center is formed in the hinge and

the signal wire covered with the ground wire mesh passes through the through hole formed along the open/close axis.

4. A communication device according to claim 3, wherein

the hinge is made of metal,

the first substrate and the second substrate are in contact with the hinge to be electrically conductive with each other and

the ground wire mesh covering the signal wire is electrically conductive at a portion contacting the hinge.

5. A communication device according to claim 3, wherein

the first housing includes a base which is connected to the hinge and a liquid crystal display part which is supported on the base to be rotatable on a rotation shaft of the hinge extending perpendicular to the open/close axis such that the liquid crystal display part is flipped over,

a through hole is formed in the center portion of the rotation shaft,

the first substrate is attached to the liquid crystal display part and

the signal wire covered with the ground wire mesh passes through the through hole formed in the rotation shaft of the base.

6. A communication device according to claim 5, wherein

the hinge is made of metal,

the first substrate and the second substrate are in contact with the hinge to be electrically conductive with each other and

the ground wire mesh covering the signal wire is electrically conductive at a portion contacting the hinge.

7. A communication device according to claim 3, wherein

certain portions of the signal wire covered with the ground wire mesh are covered with marking tapes and

the marking tapes function as markers for passing the signal wire through the hinge and connecting the signal wire to the first substrate and the second substrate.