Connecting flexible circuitry by stitching

• US 20060179652A1
• Filed: 01/24/2006
• Published: 08/17/2006
• Est. Priority Date: 07/25/2003
• Status: Abandoned Application

• Current Assignee: Allan Wilson, Michael Petersen, Mykola Sherstyuk
• Original Assignee: Allan Wilson, Michael Petersen, Mykola Sherstyuk
• Inventors: Sherstyuk, Mykola, Petersen, Michael, Wilson, Allan
• Application Number:
  US11/337,802
• Publication Number:
  US 20060179652A1
• Time in Patent Office: Days
• US Class Current: 29/825
• CPC Class Codes: H05K 2201/10287 Metal wires as connectors or conductors
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 2203/1189 Pressing leads, bumps or a die through an insulating layer
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/365 by abutting, i.e. without alloying process
• CPC Class Codes: H05K 3/4046 using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A means is described of connecting multiple flexible printed circuit (FPC) tags. The means is suitable where electrical circuitry has been printed or otherwise applied to one side of flexible substrates, and where the circuitry of two such substrates is required to be brought into electrical continuity. In this method, a sewing, stitching or embroidery machine is used to hold juxtaposed conductive surfaces in electrical continuity by tension. In a variation of the means, conductive thread, wire or other material is used to create an electrically-conducting via between the relevant conductive surfaces of two or more such FPC tags.

Claims

1. A method of connecting two or more layers of flexible printed circuitry (FPC) each having at least one conducting pathway thereon, where electrical continuity between the respective conducting pathways is required, comprising:

providing two or more non-conductive, flexible substrates;

bringing such substrates into close juxtaposition whereby the at least one conducting pathway of one of said substrates is in electrical contact with the at least one conducting pathway of an other of said substrates; and

sewing such substrates together so as to maintain said conducting pathways in electrical contact with each other

2. The method of claim 1 wherein said sewing step is performed by a stitching, sewing or embroidery machine or device.

4. The method of claim 2], where non-conducting thread is used to hold the juxtaposed conducting surfaces of two FPC tags in electrically-conductive contact by tension.

5. The method of claim 1, where conductive thread, wire or other material is used to create an electrically conducting pathway or via between the conducting surfaces of two or more juxtaposed or non-juxtaposed FPC tags by repetitive stitching through the conductive surfaces of interest on the respective FPC'"'"'s.

6. The method of claim 2, where conductive thread, wire or other material is used to create an electrically conducting pathway or via between the conducting surfaces of two or more juxtaposed or non-juxtaposed FPC tags by repetitive stitching through the conductive surfaces of interest on the respective FPC'"'"'s.

7. The method of claim 1, wherein said sewing is selected from the group comprising chain stitching, lock stitching and zigzag stitching.

3. The method of claim, where non-conducting thread is used to hold the juxtaposed conducting surfaces of two FPC tags in electrically-conductive contact by tension.

8. A method of connecting two or more layers of flexible printed circuitry (FPC) each having at least one conducting pathway thereon, where electrical continuity between the respective conducting pathways is required, comprising:

providing two or more non-conductive, flexible substrates;

bringing such substrates into close juxtaposition whereby one of said substrates is in contact with the at least one conducting pathway of an other of said substrates so as to act as a dielectric with respect thereto; and

sewing such substrates together using an electrically conductive thread, wire or other material so as to create an electrically conductive pathway between the at least one conducting pathway of said one substrate and the at least one conducting pathway of said other substrate.

9. The method of claim 8, wherein said sewing is selected from the group comprising chain stitching, lock stitching and zigzag stitching.