Lead-free solder paste

• US 20060180245A1
• Filed: 02/15/2005
• Published: 08/17/2006
• Est. Priority Date: 02/15/2005
• Status: Abandoned Application

• Current Assignee: Qualitek International, Inc.
• Original Assignee: Qualitek International, Inc.
• Inventors: Wicker, Tippy, Han, Phodi
• Application Number:
  US11/058,126
• Publication Number:
  US 20060180245A1
• Time in Patent Office: Days
• US Class Current: 148/23
• CPC Class Codes: B23K 35/025 Pastes, creams, slurries
• CPC Class Codes: B23K 35/262 Sn as the principal constituent
• CPC Class Codes: B23K 35/30 with the principal constituent melting at less than 1550 degrees C
• CPC Class Codes: B23K 35/3612 with organic compounds as principal constituents
• CPC Class Codes: B23K 35/3613 Polymers, e.g. resins
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 2203/161 Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
• CPC Class Codes: H05K 3/3485 Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12

Abstract

A lead-free solder paste suitable for soldering components in electronic or microelectronic circuitry including a solder powder and a flux medium. The flux medium includes at least one colored dye material and at least one fluorescent dye material. The solder paste upon melting undergoes a color change from a colored state to a colorless metallic state and the melted solder paste fluoresces under black light.

Claims

1. A lead-free solder paste comprising:

a solder powder; and

a flux medium including at least one colored dye material and at least one fluorescent dye material;

wherein upon melting the solder paste undergoes a color change from a colored state to a colorless metallic state and the melted solder paste fluoresces under black light.

2. The lead-free solder paste of claim 1, wherein the solder paste comprises at least about 80 composition weight percent solder powder.

3. The lead-free solder paste of claim 1, wherein the solder powder has a particle size of about 25 to about 45 microns.

4. The lead-free solder paste of claim 1, wherein the solder powder comprises at least one metallic component selected from the group consisting of tin, bismuth, gold, germanium, silver, gallium, antimony, indium, zinc, copper, phosphorous, silicon and combinations thereof.

5. The lead-free solder paste of claim 1, wherein the solder paste comprises at least about 5 composition weight percent flux medium.

6. The lead-free solder paste of claim 1, wherein the flux medium comprises at least about 0.2 weight percent of at least one colored dye material.

7. The lead-free solder paste of claim 1, wherein the flux medium comprises at least about 0.01 weight percent of at least one fluorescent dye material.

8. The lead-free solder paste of claim 1, wherein the flux medium further comprises a tackifying material.

9. The lead-free solder paste of claim 1, wherein the flux medium further comprises a rheological modifier.

10. A lead-free solder paste comprising:

about 80 to about 95 composition weight percent of a solder powder including at least two metallic components;

about 5 to about 20 composition weight percent of a flux medium including a rosin tackifying material, at least one organic acid, a rheological modifier, at least one colored dye material and at least one fluorescent dye material;

wherein upon melting the solder paste undergoes a color change from a colored state to a colorless metallic state and the melted solder paste fluoresces under black light.

11. The lead-free solder paste of claim 10, wherein the solder powder comprises at least about 85 weight percent tin.

12. The lead-free solder paste of claim 10, wherein the rosin tackifying material comprises a hydrogenated rosin.

13. The lead-free solder paste of claim 10, wherein the flux medium further comprises a surfactant.

14. The lead-free solder paste of claim 13, wherein the surfactant is selected from the group consisting of ethoxylated amines, alkanolamines, ethoxylated alcohols and combinations thereof.

15. A lead-free solder paste comprising:

about 86 to about 91 composition weight percent of a solder powder including tin, silver and copper;

about 9 to about 14 composition weight percent of a flux medium, the flux medium including;

about 45 to about 50 weight percent hydrogenated rosin;

about 0.5 to about 15 composition weight percent organic acid;

about 2 to about 6 weight percent rheological modifier;

about 1 to about 15 weight percent surfactant;

about 0.2 to about 4 weight percent of at least one green dye material; and

about 0.01 to about 4 weight percent of at least one fluorescent dye material;

wherein upon melting the solder paste undergoes a color change from a colored state to a colorless metallic state and the melted solder paste fluoresces under black light.

16. The lead-free solder paste of claim 15, wherein the solder powder comprises:

about 85 to about 99 weight percent tin;

about 2 to about 6 weight percent silver; and

about 0.1 to about 2 weight percent copper.

17. The lead-free solder paste of claim 15, wherein the flux medium further comprises a plasticizer.

18. The-lead free solder paste of claim 17, wherein the flux medium comprises about 1 to about 30 weight percent plasticizer.

19. The-lead free solder paste of claim 15, wherein the flux medium further comprises about 10 to about 60 composition weight percent solvent.

20. The lead-free solder paste of claim 19, wherein the solvent comprises glycol ether.