Remote processing of workpieces

• US 20060180582A1
• Filed: 02/24/2006
• Published: 08/17/2006
• Est. Priority Date: 08/29/2003
• Status: Active Grant

• Current Assignee: Trumpf Laser- und Systemtechnik GmbH (TRUMPF SE + Co. KG)
• Original Assignee: Trumpf Laser- und Systemtechnik GmbH (TRUMPF SE + Co. KG)
• Inventors: Kaupp, Peter, Andreasch, Wolfgang, Horn, Armin
• Granted Patent: US 8,084,708 B2
• Time in Patent Office: Days
• US Class Current: 219/121.830
• CPC Class Codes: B23K 26/04 Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light

Abstract

Systems and related methods of programming a laser processing device for automated processing of a workpiece including indicating a processing location on a workpiece with a processing location indicator. The processing location is detected with a processing location detector. The scanner optics of the laser processing device are adjusted to a set position corresponding to the detected processing location. A set position of the scanner optics is detected with a processing location evaluator, and a control program corresponding to the detected set position of the scanner optics is generated with the processing location evaluator.

Claims

1. A programmable laser processing system comprising:

a numerically controlled optics driver;

scanner optics drivably connected to the optics driver and configured to direct a laser processing beam onto a workpiece;

a processing location indicator operable to indicate a desired processing location on the workpiece;

a processing location detector configured to detect a processing location from the desired processing location;

an optics driver controller in electrical communication with the optics driver and configured to adjust the scanner optics, through the optics driver, to focus on the detected processing location; and

a processing location evaluator configured to generate a control program based on the detected processing location in response to receiving a switching signal from the processing location indicator, and to deliver the control program to the optics driver controller for subsequent processing.

2. The laser processing system according to claim 1, further comprising a manual switch disposed electrically between the processing location evaluator and the processing location indicator and configured to trigger delivery of the switching signal from the processing location indicator to the processing location evaluator when actuated.

3. The laser processing system according to claim 2, wherein the manual switch is disposed on the processing location indicator.

4. The laser processing system according to claim 1, wherein the processing location indicator comprises a light pointer configured to indicate the processing location with a light mark.

5. The laser processing system according to claim 1, wherein the processing location indicator is configured to indicate the processing location with a light mark visible on the surface of the workpiece.

6. The laser processing system according to claim 1, wherein the processing location indicator comprises a tactile indicator configured to indicate the processing location through physical contact with the workpiece.

7. The laser processing system according to claim 1, wherein the process location detector comprises an optical detection device.

8. The laser processing system according to claim 7, wherein an optical axis of the optical detection device coincides with a beam axis of the laser processing beam.

9. A method of programming a laser processing device for automated processing of a workpiece, the method comprising:

indicating a processing location on a workpiece with a processing location indicator;

detecting the processing location with a processing location detector;

adjusting scanner optics of the laser processing device to a set position corresponding to the detected processing location;

detecting the set position of the scanner optics with a processing location evaluator; and

generating a control program corresponding to the detected set position of the scanner optics with the processing location evaluator.

10. The method according to claim 9, wherein indicating the processing location comprises manually guiding the processing location indicator over a surface of the workpiece.

11. The method according to claim 9, wherein the processing location indicator comprises a manually guided tactile pointer, and wherein indicating the processing location comprises physically contacting the workpiece with the tactile pointer at a position on a surface of the workpiece corresponding to the processing location.

12. The method according to claim 9, wherein the processing location indicator comprises a light pointer, and wherein indicating a the processing location comprises projecting a light mark onto the surface of the workpiece with the light pointer.

13. The method according to claim 9, further comprising directing a laser processing beam onto the processing location using the control program.

14. The method according to claim 13, wherein directing the laser processing beam onto the processing location comprises laser welding or laser writing on the workpiece.

15. The method according to claim 9, wherein generating the control program comprises actuating the processing location evaluator.

16. The method according to claim 15, wherein indicating the processing location comprises indicating a weld path including manually guiding the processing location indicator over a surface of the workpiece in a course corresponding to the weld path with the processing locator actuated.

17. The method according to claim 15, wherein actuating the processing location evaluator comprises triggering delivery of a switching signal from the processing location indicator to the processing location evaluator.

18. The method according to claim 17, wherein delivery of the switching signal is triggered with a manual switch.

19. The method according to claim 18, wherein the manual switch is disposed on the processing location indicator.

20. The method according to claim 17, wherein the switching signal is selected from the group consisting of an electrical switching signal, an acoustic switching signal, and an optical switching signal.

21. The method according to claim 9, wherein the processing location detector comprises an optical detection device.

22. The method according to claim 21, wherein the processing location is detected with image processing.

23. The method according to claim 22, wherein the scanner optics comprise mirrors, and wherein the optical detection device detects the processing location from an image reflected through the mirrors.

24. The method according to claim 23, wherein an optical axis of the optical detection device coincides with a beam axis of a laser processing beam of the laser processing device.

25. The method according to claim 23, wherein adjusting the scanner optics of the laser processing device comprises automatically adjusting the scanner mirrors such that the desired processing location is maintained substantially centered in the image.

26. A laser processor programming system, comprising:

a processing location indicator operable to indicate a processing location on a workpiece;

a processing location detector configured to detect the processing location through scanner optics of the laser processor;

an optics controller configured to the adjust the scanner optics to a set position coinciding with the detected processing location; and

a processing location evaluator configured to detect the set position of the scanner optics, and, in response, generate a control program for subsequent processing of the workpiece.

27. The laser processor programming system according to claim 26, wherein the processing location indicator comprises a manually engageable switch configured to actuate the processing location evaluator, thereby detecting the set position of the scanner optics and generating the control program.

28. The laser processor programming system according to claim 26, wherein the processing location detector comprises an optical detection device selected from the group consisting of a position sensitive detector, a charge-coupled device camera, and a four quadrant diode.

29. The laser processor programming system according to claim 26, wherein the optics controller comprises memory configured to store the control program for subsequent processing of additional workpieces.