Ground arch for wirebond ball grid arrays

• US 20060180916A1
• Filed: 07/30/2004
• Published: 08/17/2006
• Est. Priority Date: 07/30/2003
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Wyland, Chris
• Granted Patent: US 7,217,997 B2
• Time in Patent Office: Days
• US Class Current: 257/691
• CPC Class Codes: H01L 2223/6611 Wire connections
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/484 Connecting portions
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/73221 Strap and wire connectors
• CPC Class Codes: H01L 2224/73229 Wire and TAB connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85201 Compression bonding
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/91 : Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/1616 : Cavity shape
• CPC Class Codes: H01L 2924/1617 : Cavity coating
• CPC Class Codes: H01L 2924/163 : Connection portion, e.g. seal
• CPC Class Codes: H01L 2924/166 : Material
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A structure provides for the control of bond wire impedance. In an example embodiment, there is an integrated circuit device (100) comprising an integrated circuit (130) having a plurality (115) of grounding pads, signal pads, and power pads and a package (110) for mounting the integrated circuit and includes a conductive path having at least one reference trace (140) that surrounds the integrated circuit. A grounding arch (170) formed by a dielectric-coated metal tape is disposed over the integrated circuit and connected to its ground pad in order to provide heat dissipation and EMI shielding.

Claims

1. An integrated circuit device comprising:

an integrated circuit having a plurality of grounding pads, signal pads, and power pads; and

a package for mounting the integrated circuit and including a conductive path having at least one reference trace surrounding the integrated circuit and having a grounding arch disposed over the integrated circuit.

2. The integrated circuit device of claim 1 wherein the reference trace is coupled to at least one of the following:

a voltage reference, a ground reference.

3. The integrated circuit device of claim 1 wherein, the grounding arch has an area comparable to the area of the integrated circuit device.

4. The integrated circuit device of claim 1 wherein the grounding arch is comprised of metal tape laminated with a dielectric material.

5. The integrated circuit device of claim 4, wherein the grounding arch has a predetermined thickness thereby providing sufficient structure preventing electrical contact between the grounding arch and wire bonds.

6. The integrated circuit device of claim 1 wherein the grounding arch is coupled to at least one grounding location on the integrated circuit device, wherein the grounding location includes, the grounding trace and grounding pads.

7. The integrated circuit device of claim 6 wherein the grounding location furthers includes a location about a center region on the integrated circuit device.

8. The integrated circuit device of claim 5 wherein the grounding arch comprises conductors of a highly conductive material selected from:

copper, gold, silver, aluminum and an alloys thereof.

9. The integrated circuit device of claim 5 wherein the highly conductive material is in a form including solid tape, mesh, and woven wire bonds.

10. The integrated circuit device of claim 1 wherein the grounding arch is coupled to the grounding location with at least one of the following:

conductive glue, solder, eutectic metal bond, a thermo-compression bond.

11. The integrated circuit device of claim 3, wherein the dielectric material is selected from at least one of the following:

epoxy, polyimide, polyamide, solder mask, PTFE, and TEFLON™

.

12. A method for controlling impedance of bond wires in packaging a semiconductor device die in a package, the method comprising:

defining locations of signal and power/ground pads on the device die;

defining grounding trace locations on the package;

bonding the signal pads and power/ground pads of the device die;

providing a conductive path including a ground arch over the bond wires and grounding trace locations and encapsulating the device die and ground arch.

13. The method of claim 12 wherein providing a conductive path further includes, rotating the package a pre-determined amount;

and providing an additional ground arch.

14. The method of claim 13 wherein the pre-determined amount is about 90o.

15. The method of claim 13, wherein providing an additional ground arch is a function of device design, package size, number of wire bonds, and a desired impedance.

16. The method of claim 15, wherein the desired impedance is function of a ground arch distance from a wire bond.