Camera module

• US 20060181633A1
• Filed: 06/21/2005
• Published: 08/17/2006
• Est. Priority Date: 02/16/2005
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Seo, Tae Jun
• Granted Patent: US 7,422,382 B2
• Time in Patent Office: Days
• US Class Current: 348/340
• CPC Class Codes: G02B 7/02 for lenses supports for magnifying lenses G02B25/002
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

A camera module comprises a lens array including at least one lens, a lens accommodating unit having an inner space, in which the lens array is arranged, and an incident hole, and a housing mounted on a circuit board. The housing has a counter-engagement part engaged with an engagement part formed at the lens accommodating unit such that the lens accommodating unit is moved in the direction of the optical axis. An image sensor has an image area on which light is focused. The image sensor is electrically connected to the circuit board. A filter is disposed between the lens array and the image sensor. The filter includes a transparent medium through which light introduced along the optical axis is transmitted to the image area, and a prevention film for preventing electromagnetic waves generated by the image sensor from being emitted out of the housing.

Claims

1. A camera module comprising:

a lens array including at least one lens;

a lens accommodating unit having an inner space defined therein such that the lens array is arranged along an optical axis in the inner space and an incident hole formed at the center of the front surface thereof;

a housing mounted on the upper surface of a circuit board, the housing having a counter-engagement part engaged with an engagement part formed at the lens accommodating unit such that the lens accommodating unit is moved in the direction of the optical axis;

an image sensor having an image area on which light passing through the lens array is focused, the image sensor being electrically connected to the circuit board such that the image focused on the image area is transmitted to the circuit board; and

a filter disposed between the lens array and the image sensor, the filter including a transparent medium through which light introduced along the optical axis is directly transmitted to the image area of the image sensor, and a prevention film for preventing electromagnetic waves generated by the image sensor disposed in the housing from being emitted out of the housing.

2. The module as set forth in claim 1, wherein the lens accommodating unit comprises:

a hollow cylindrical barrel, in which the lens array is arranged, the barrel having the engagement part formed at the outer circumferential surface thereof, which is engaged with the counter-engagement part formed at an inner hole of the housing; and

a cap having a male thread part formed at the outer circumferential surface thereof, which is threadly engaged with a female thread part formed at the inner circumferential surface of the barrel for fixing the lens array, the cap having the incident hole formed at the center of the front surface thereof.

3. The module as set forth in claim 1, wherein

the engagement part of the lens accommodating unit is a male thread part formed at the outer circumferential surface of the lens accommodating unit, and

the counter-engagement part of the housing is a female thread part formed at the inner hole of the housing.

4. The module as set forth in claim 1, wherein the housing is attached to the upper surface of the circuit board by a conductive bonding agent.

5. The module as set forth in claim 1, wherein the image sensor is mounted to the circuit board by metal wires in a wire bonding fashion.

6. The module as set forth in claim 1, wherein the image sensor is mounted to the circuit board by bonding bumps in a flip chip bonding fashion.

7. The module as set forth in claim 1, wherein the prevention film is a conductive layer uniformly coated on an entire area of the upper or lower surface of the transparent medium.

8. The module as set forth in claim 1, wherein the prevention film is a conductive film bonded to an entire area of the upper or lower surface of the transparent medium.

9. The module as set forth in claim 7, wherein the prevention film is made of Indium Tin Oxide (ITO).

10. The module as set forth in claim 1, wherein the filter is attached to the housing by a conductive bonding agent.

11. The module as set forth in claim 1, wherein the filter is attached to the upper surface of the image sensor by a conductive bonding agent.

12. A camera module comprising:

a lens array including at least one lens;

a lens accommodating unit having an inner space defined therein such that the lens array is arranged along an optical axis in the inner space and an incident hole formed at the center of the front surface thereof;

a housing mounted on the upper surface of a circuit board such that the housing is connected to at least one ground terminal of the circuit board, the housing having a counter-engagement part engaged with an engagement part formed at the lens accommodating unit such that the lens accommodating unit is moved in the direction of the optical axis;

an image sensor having an image area on which light passing through the lens array is focused, the image sensor being electrically connected to the circuit board such that the image focused on the image area is transmitted to the circuit board; and

a filter disposed between the lens array and the image sensor, the filter including a transparent medium through which light introduced along the optical axis is directly transmitted to the image area of the image sensor, and a prevention film for preventing electromagnetic waves generated by the image sensor disposed in the housing from being emitted out of the housing.

13. The module as set forth in claim 12, wherein the lens accommodating unit comprises:

a hollow cylindrical barrel, in which the lens array is arranged, the barrel having the engagement part formed at the outer circumferential surface thereof, which is engaged with the counter-engagement part formed at an inner hole of the housing; and

a cap having a male thread part formed at the outer circumferential surface thereof, which is threadly engaged with a female thread part formed at the inner circumferential surface of the barrel for fixing the lens array, the cap having the incident hole formed at the center of the front surface thereof.

14. The module as set forth in claim 12, wherein the engagement part of the lens accommodating unit is a male thread part formed at the outer circumferential surface of the lens accommodating unit, and

the counter-engagement part of the housing is a female thread part formed at the inner hole of the housing.

15. The module as set forth in claim 12, wherein the housing is made of a material containing a conductive material.

16. The module as set forth in claim 12, wherein the housing has a conductive layer of a conductive material uniformly coated on an entire area of the inner or outer surface thereof, the conductive layer of the housing being electrically connected to the at least one ground terminal of the circuit board.

17. The module as set forth in claim 12, wherein the housing is attached to the at least one ground terminal of the circuit board by a conductive bonding agent.

18. The module as set forth in claim 12, wherein the image sensor is mounted to the circuit board by metal wires in a wire bonding fashion.

19. The module as set forth in claim 12, wherein the image sensor is mounted to the circuit board by bumps in a flip chip bonding fashion.

20. The module as set forth in claim 12, wherein the prevention film is a conductive film bonded to an entire area of the upper or lower surface of the transparent medium.

21. The module as set forth in claim 20, wherein the prevention film is made of Indium Tin Oxide (ITO).

22. The module as set forth in claim 12, wherein the filter is attached to the housing by a conductive bonding agent.

23. The module as set forth in claim 12, wherein the filter is attached to the upper surface of the image sensor by a conductive bonding agent.