Selective deposition of embedded transient protection for printed circuit boards
First Claim
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1. A printed circuit board with integrated transient protection, the printed circuit board comprising:
- a transient protection material selectively deposited on portions of one or more planes selected from a signal plane, a power plane and a ground plane, and wherein said selectively deposited transient protection material is in contact with a conductive material in any of said one or more planes.
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Abstract
Protection for sensitive components on a printed circuit board by selectively depositing transient protection material on one or more layers of the printed circuit board is disclosed.
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Citations
22 Claims
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1. A printed circuit board with integrated transient protection, the printed circuit board comprising:
a transient protection material selectively deposited on portions of one or more planes selected from a signal plane, a power plane and a ground plane, and wherein said selectively deposited transient protection material is in contact with a conductive material in any of said one or more planes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for making a printed circuit board with integrated transient protection, the method comprising:
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printing and etching a copper clad core material comprising any one of resin impregnated fiberglass cloth, random fiber and film material;
selectively depositing a transient protection material on portions of one or more planes selected from a signal plane, a power plane and a ground plane, and wherein said selectively deposited transient protection material is in contact with a conductive material on any of said one or more planes; and
laminating said copper clad core into a multilayer PCB structure and completing a fabrication process of said PCB comprising;
drilling holes, depositing conductive seed, imaging, plating, etching outer layer copper to form component mounting pads connected to elements of selectively deposited transient protection material. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A system with integrated transient protection, the system comprising:
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a multi-layered printed circuit board having a length, a width and a cross-sectional area;
a plurality of electrical components on one or more layers of said multi-layered printed circuit board, wherein said multi-layered printed circuit board comprises at least one signal region, at least one power region, and at least one ground region; and
a transient protection material selectively deposited on portions of said one or more layers or regions, wherein said selectively deposited transient protection material is in contact with a conductive material in any of said one or more layers or regions.
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17. A planar distributed capacitance structure with integrated transient protection, the planar distributed capacitance structure comprising:
multiple layers having a length, a width and a cross-sectional area, said multiple layers including at least one sub-composite structure, wherein said sub-composite structure includes transient protection material and at least two layers of conductive material, and having a capacitance of at least 100 picofarads per square inch. - View Dependent Claims (18, 19)
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20. A system with integrated transient protection, the system comprising:
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a multi-layered planar distributed capacitance structure having a length, a width and a cross-sectional area;
a plurality of electrical components on one or more layers of said multi-layered planar distributed capacitance structure; and
wherein said multi-layered planar distributed capacitance structure comprises at least one sub-composite structure, wherein said sub-composite structure includes transient protection material and at least two layers of conductive material, and having a capacitance of at least 100 picofarads per square inch. - View Dependent Claims (21, 22)
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Specification