METHOD AND APPARATUS FOR PROVIDING OPTOELECTRONIC COMMUNICATION WITH AN ELECTRIC DEVICE

• US 20060182397A1
• Filed: 04/11/2006
• Published: 08/17/2006
• Est. Priority Date: 01/14/2004
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Benner, Alan F., Shinde, Subhash L., Lin, How Tzu, Pompeo, Frank L.
• Granted Patent: US 7,544,527 B2
• Time in Patent Office: Days
• US Class Current: 385/89
• CPC Class Codes: G02B 6/4212 the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4231 with intermediate elements, e.g. rods and balls, between the elements
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors

Abstract

An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the second surface of the transparent substrate. A first substrate is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.

Claims

1. A method of fabricating an optoelectronic assembly for communicating a signal from a system electronic chip set on an MCM, the system electronic chip set adapted for at least one of data processing, data switching, and data storage, to another component in a computer system, the method comprising:

metallizing a first surface of a transparent substrate as an electrical signaling medium between the support electronic chip set and the optoelectronic transducer on the combination of the transparent substrate and the chip carrier for electrical interconnection thereof;

where the support electronic chip set is configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions;

bonding the support electronic chip set and optoelectronic transducer to the chip carrier;

interconnecting electrically the support electronic chip set to the optoelectronic transducer via the metallized transparent substrate;

attaching the chip carrier to a second substrate;

attaching a heat sink to a second surface opposite said first surface of said transparent substrate, said heat sink configured with a connector receptacle configured to receive a fiber array connector therein and provide optical communication through said second surface to said optoelectronic transducer; and

bonding a fiber array disposed in the fiber array connector to the transparent substrate optically aligned with the optoelectronic transducer to provide an optical signaling medium to the optoelectronic transducer,

wherein the electronic chip set and the optoelectronic transducer share a common thermal path for cooling thereof.

2. The method of claim 1, wherein the fiber array connector includes a make once connector having a fiber cable bundle extending therefrom.

3. The method of claim 1, wherein said bonding said fiber array to the transparent substrate is substantially one of normal and coplanar with said transparent substrate.

4. The method of claim 1, further comprising:

a SiC heat spreader having a first and second surface, said SiC heat spreader configured to receive said fiber array therethrough to maintain optical communication through said first substrate to said optoelectronic transducer, said first surface in thermal communication with a heat sink while said second surface is in thermal communication with said first surface of said transparent substrate, said SiC heat spreader configured to provide unimpeded heat flow from said second surface to said first surface.

5. The method of claim 1, wherein attaching the second substrate comprises a multi-chip module, a dual-chip module, a single-chip module, or any combination thereof;

and the first substrate is an organic or a ceramic substrate containing electrical interconnects, wherein the electrical connection between the first and second substrate uses micro solder balls with a pitch of less than or equal to 500 microns.