Explantation of implantable medical device

• US 20060184210A1
• Filed: 04/13/2006
• Published: 08/17/2006
• Est. Priority Date: 05/16/2003
• Status: Abandoned Application

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Singhal, Ruchika, Skime, Robert M., Wahlstrand, Carl D., Sharan, Ashwini
• Application Number:
  US11/403,575
• Publication Number:
  US 20060184210A1
• Time in Patent Office: Days
• US Class Current: 607/45
• CPC Class Codes: A61N 1/37514 Brain implants

Abstract

In general, the invention is directed to apparatus and techniques that aid in the removal or explantation of an implantable medical device (IMD) under the scalp of a patient. The various embodiments of the invention address risks associated with the explantation, such as the risk of damage to leads, the risk of damage to the IMD, the risk that the incision may hinder the explantation, and the risk that the IMD may be difficult to remove. In some embodiments, the invention is directed to apparatus that help the surgeon identify the location of the implanted elements, and that protect the implanted elements from inadvertent damage. In other embodiments, the invention is directed to techniques that facilitate the removal of the IMD.

Claims

1. An implantable medical device comprising:

at least one module that includes control electronics within a housing; and

a lead management structure coupled to the module and configured to receive and protect a body of a lead that is coupled to the implantable medical device,

wherein the implantable medical device is configured to be implanted between a scalp and a skull of a patient.

2. The device of claim 1, wherein the lead management structure comprises a groove.

3. The device of claim 2, wherein the device defines a periphery and wherein the lead management structure comprises a groove around the periphery of the device.

4. The device of claim 1, wherein the lead management structure comprises a pocket.

5. The device of claim 1, further comprising a member that at least partially encapsulates the housing.

6. The device of claim 5, wherein the lead management structure comprises a groove in the member.

7. The device of claim 6, wherein the member defines a periphery and wherein the groove is located around the periphery of the member.

8. The device of claim 5, wherein the lead management structure comprises a pocket in the member.

9. The device of claim 5, further comprising a plurality of modules, each of the modules including a respective one of a plurality of housings, wherein the member at least partially encapsulates each of the housings.

10. The device of claim 1, wherein the device is configured to be implanted at least one of on or recessed into the skull of a patient.

11. The device of claim 1, wherein the device comprises an implantable neurostimulator.