Method for determining the position of a milling tool and a machining head designed for carrying out the method

• US 20060185144A1
• Filed: 02/23/2006
• Published: 08/24/2006
• Est. Priority Date: 02/24/2005
• Status: Active Grant

• Current Assignee: LPKF Laser & Electronics AG
• Original Assignee: LPKF Laser & Electronics AG
• Inventors: Wenke, Stephan, Klocke, Andreas, Heuer, Boris
• Granted Patent: US 7,559,152 B2
• Time in Patent Office: Days
• US Class Current: 29/33.K
• CPC Class Codes: B23Q 17/2216 for adjusting the tool into its holder B23Q17/0923 - B23Q17/0942 takes precedence
• CPC Class Codes: Y10T 29/5191 Assembly
• CPC Class Codes: Y10T 409/303752 Process
• CPC Class Codes: Y10T 409/309408 with cutter holder

Abstract

A method for determining the position of a milling tool for micro-structuring a substrate relative to a machining head, the machining head including a tool holder securing the milling tool, includes placing the milling tool against a reference surface of the substrate, opening the tool holder to enable an axial mobility of the milling tool relative to the machining head, and moving the machining head relative to the reference surface until a predetermined distance between the machining head and the reference surface is reached.

Claims

1. A method for determining the position of a milling tool for micro-structuring a substrate relative to a machining head, the machining head including a tool holder securing the milling tool, the method comprising:

placing the milling tool against a reference surface of the substrate;

opening the tool holder to enable an axial mobility of the milling tool relative to the machining head; and

moving the machining head relative to the reference surface until a predetermined distance between the machining head and the reference surface is reached.

2. The method as recited in claim 1, further comprising securing the milling tool non-positively in the tool holder at the predetermined distance between the machining head and the reference surface.

3. The method as recited in claim 1, wherein the moving of the machining head is performed in a direction of the reference surface so that the milling tool, which is stationarily secured with respect to the reference surface, is inserted into the tool holder.

4. The method as recited in claim 1, wherein the placing of the milling tool is performed so that an axial extension of the milling tool contacts the reference surface.

5. The method as recited in claim 1, wherein the milling tool has a conical section and the reference has a recess, and wherein the placing of the milling tool is performed so that a circumference of the conical section contacts an edge area of the recess.

6. The method as recited in claim 1, wherein the opening of the tool holder is performed before the placing the milling tool against the reference surface and in a position above the reference surface, so that the milling tool slides axially in the tool holder down to the reference surface under the effect of gravity.

7. The method as recited in claim 1, wherein the milling tool is moved relative to the tool holder towards the reference surface using of a spring element.

8. A device for micro-structuring a substrate, comprising:

a milling tool;

a machining head having a holder, the holder axially holding the milling tool at a machining position in a closed state, and enabling a guided axial sliding of the milling tool in an opened state, wherein the machining position is a predetermined axial distance from a surface of the substrate.

9. The device as recited in claim 8, wherein the machining head has a milling depth limiter disposed against the reference surface so as to set the predetermined distance.

10. The device as recited in claim 9, wherein the reference surface has two planes.