Electronic component mounting method and electronic component mounting apparatus

• US 20060185162A1
• Filed: 01/27/2006
• Published: 08/24/2006
• Est. Priority Date: 01/28/2005
• Status: Active Grant

• Current Assignee: Yamaha Hatsudoki Kabushiki Kaisha (Yamaha Corporation)
• Original Assignee: Hitachi High-Tech Instruments Co., Ltd. (Hitachi, Ltd.)
• Inventors: Aoki, Akira, Fukushima, Yoshiharu, Kameda, Makio, Seto, Katsuyuki, Fukushima, Hideaki
• Granted Patent: US 7,721,424 B2
• Time in Patent Office: Days
• US Class Current: 29/832
• CPC Class Codes: H05K 13/0452 Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place H05K13/0406, H05K13/041 take precedence
• CPC Class Codes: H05K 13/0853 Determination of transport trajectories inside mounting machines
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49131 by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/53039 with control means energized in response to activator stimulated by condition sensor
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53191 Means to apply vacuum directly to position or hold work part

Abstract

The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.

Claims

1. A method of mounting an electronic component, comprising:

picking up a plurality of electronic components from a component feeding unit by suction using a plurality of suction nozzles;

taking images of the electronic components held by the suction nozzles using a component recognition camera;

performing a recognition processing to the images taken by the component recognition processing camera;

releasing one of the electronic components that is judged improper as a result of the recognition processing; and

mounting on a printed board electronic components that are judged proper as the result of the recognition processing after the releasing of the improper electronic component.

2. The method of claim 1, further comprising changing the order of the releasing and the mounting.

3. A method of mounting an electronic component, comprising:

picking up a plurality of electronic components from a component feeding unit by suction using a plurality of suction nozzles;

detecting postures of the electronic components held by the suction nozzles;

releasing one of the electronic components that is judged improper as a result of the detecting;

taking, after the releasing of said one of the electronic components, images of electronic components that are judged proper as the result of the detecting using a component recognition camera;

performing a recognition processing to the images taken by the component recognition camera;

releasing another of the electronic components that is judged improper as a result of the recognition processing; and

mounting on a printed board electronic components that are judged proper as the result of the recognition processing after the releasing of said another of the improper electronic components.

4. The method of claim 3, further comprising changing the order of the releasing and the mounting so that the electronic components judged proper by the detecting and the recognition processing are mounted on the printed board and the electronic components judged improper by the detecting or the recognition processing are released after the mounting.

5. A method of mounting an electronic component, comprising:

picking up a plurality of electronic components from a component feeding unit by suction using a plurality of suction nozzles;

detecting postures of the electronic components held by the suction nozzles;

taking images of the electronic components held by the suction nozzles using a component recognition camera;

performing a recognition processing to the images taken by the component recognition camera;

mounting on a printed board electronic components judged proper as a result of the detecting and as a result of the recognition processing; and

releasing one of the electronic components that is judged improper as the result of the detecting or as the result of the recognition processing after the mounting of the proper electronic components on the printed board.

6. An electronic component mounting apparatus comprising:

a component feeding unit storing a plurality of electronic components;

a plurality of suction nozzles picking up the electronic components from the component feeding unit;

a component recognition camera taking images of the electronic components held by the suction nozzles;

a recognition processing device performing a recognition process to the images taken by the component recognition camera; and

a selection device alternating an operation of the apparatus between a first mounting sequence in which electronic components judged proper as a result of the recognition processing are mounted on a printed board after electronic components judged improper as the result of the recognition process are released from the suction nozzles and a second mounting sequence in which the electronic components judged improper as the result of the recognition process are released from the suction nozzles after the electronic components judged proper as the result of the recognition processing are mounted on a printed board.

7. An electronic component mounting apparatus comprising:

a component feeding unit storing a plurality of electronic components;

a plurality of suction nozzles picking up the electronic components from the component feeding unit;

a detection device detecting postures of the electronic components held by the suction nozzles;

a component recognition camera taking images of the electronic components held by the suction nozzles;

a recognition processing device performing a recognition process to the images taken by the component recognition camera; and

a selection device alternating an operation of the apparatus between a first mounting sequence in which electronic components judged proper as a result of the detecting and as a result of the recognition processing are mounted on a printed board after electronic components judged improper as the result of the detecting or as the result of the recognition process are released from the suction nozzles and a second mounting sequence in which the electronic components judged improper as the result of the detecting or as the result of the recognition process are released from the suction nozzles after the electronic components judged proper as the result of the detecting and as the result of the recognition processing are mounted on a printed board.

8. The electronic component mounting apparatus of claim 7, wherein the detection device comprises a line sensor unit.

9. The electronic component mounting apparatus of claim 7, further comprising a box that is disposed between the component feeding unit and the printed board positioned for the mounting and is configured to receive the released improper electronic components.