Cryogenic computer system with parallel multiple cooling temperatures
First Claim
1. A cryogenic computer system with parallel multiple cooling temperatures comprising of:
- a single or multiple microprocessor computer system with at least a minimum set of hardware of a motherboard, memory (RAM), data storage (hard drive), video graphics card, and other necessary components, a cryogenic cooling system providing simultaneous cooling of microprocessor and computer components down to different temperatures by supplying at least one refrigerant to said microprocessor and computer components.
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Accused Products
Abstract
An energy efficient cryocooler is disclosed that cools a large area with multiple cooling temperatures on multiple cooled area working in parallel for the maximum cryogenic cooling and “over-clocking” of microprocessors and computer components using liquid and/or gaseous refrigerants in phase change. A cryogenic cooling system provides simultaneous steady stream (or pulse) cryocooling of a computer components with each part of the computer system receiving cooling at it'"'"'s optimum temperature. The system comprises an evaporator with liquid and gaseous refrigerant which evaporator is placed onto the microprocessor to disperse heat from said microprocessor and a enclosure around the cooled system that cools all other components in one stage. The use of the invented cryocooling system resulted in the increase 2.4 GHz “Celeron D” microprocessor frequency to 4.78 GHz. The RAM was also overclocked to 60 MHz above normal on a test system. The cryogenic cooling system is cost effective and energy effective in power and refrigerant consumption.
18 Citations
4 Claims
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1. A cryogenic computer system with parallel multiple cooling temperatures comprising of:
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a single or multiple microprocessor computer system with at least a minimum set of hardware of a motherboard, memory (RAM), data storage (hard drive), video graphics card, and other necessary components, a cryogenic cooling system providing simultaneous cooling of microprocessor and computer components down to different temperatures by supplying at least one refrigerant to said microprocessor and computer components. - View Dependent Claims (2, 3, 4)
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Specification