Electromagnetic interference shielding of electrical cables and connectors

• US 20060185884A1
• Filed: 04/07/2006
• Published: 08/24/2006
• Est. Priority Date: 04/17/2000
• Status: Active Grant

• Current Assignee: Deep Coat, LLC
• Original Assignee: WaveZero, Inc.
• Inventors: Ortiz, Jesus Al, Arnold, Rocky R.
• Granted Patent: US 7,414,197 B2
• Time in Patent Office: Days
• US Class Current: 174/74.R
• CPC Class Codes: H01R 13/6599 Dielectric material made conductive, e.g. plastic material coated with metal
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49171 with encapsulating
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor
• CPC Class Codes: Y10T 29/49176 with molding of electrically insulating material
• CPC Class Codes: Y10T 29/4922 with molding of insulation
• CPC Class Codes: Y10T 29/49222 forming array of contacts or terminals

Abstract

A shielded cable includes a cable body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.

Claims

1. A shielded cable comprising:

a cable body comprising electrical conductors disposed within an insulating substrate;

a vacuum metallized shielding layer disposed over the insulating substrate, and

a metallized thermoform connector coupled to an end portion of the cable body and electrically coupled to the vacuum metallized layer, wherein the connector can be electrically coupled to a grounded housing so as to ground the shielding layer and connector.

2. The cable of claim 1 further comprising an insulating top coating disposed over the vacuum metallized layer to insulate the vacuum metallized layer.

3. The cable of claim 2 wherein the insulating top layer extends to a point short of the connector such that the connector is electrically coupled to the metallized layer.

4. The cable of claim 1 wherein the vacuum metallized layer has a thickness between approximately one-half micron to twelve microns.

5. The cable of claim 1 wherein the metallized thermoform is coupled to an outsize surface of a nonconductive connector.

6. The cable of claim 1 wherein the connector further comprises spaced protrusions, wherein the connector is electrically coupled to the metallized layer with the spaced protrusions.