Light emitting diode package and fabrication method thereof
First Claim
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1. A light emitting diode package comprising:
- a submount silicon substrate;
an insulating film and electrode patterns formed on the insulating film on the submount silicon substrate;
a spacer having a through hole, formed on the electrode patterns;
an LED received in the through hole, flip-chip bonded to the electrode patterns; and
a planar optical element adhered to the upper surface of the spacer.
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Abstract
The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.
34 Citations
19 Claims
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1. A light emitting diode package comprising:
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a submount silicon substrate;
an insulating film and electrode patterns formed on the insulating film on the submount silicon substrate;
a spacer having a through hole, formed on the electrode patterns;
an LED received in the through hole, flip-chip bonded to the electrode patterns; and
a planar optical element adhered to the upper surface of the spacer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A fabrication method of a light emitting diode package comprising steps of:
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forming an insulating film and electrode patterns on the insulating film on a submount silicon substrate;
mounting an LED on the electrode patterns by flip-chip bonding;
placing a spacer having a through hole on the electrode patterns to dispose the LED in the through hole; and
adhering a planar optical element to the upper surface of the spacer. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A fabrication method of light emitting diode packages comprising steps of:
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forming an insulating film and a plurality of electrode patterns in their order on a silicon substrate;
mounting a plurality of LEDs on the electrode patterns by flip-chip bonding;
placing a spacer having a plurality of through holes on the plurality of electrode patterns to dispose each of the plurality of LEDs in each of the through holes;
adhering a planar optical element to the upper surface of the spacer; and
dicing a resultant structure with the planar optical element adhered thereto into individual LED packages.
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Specification