Chip scale package with heat spreader

• US 20060186533A1
• Filed: 04/18/2006
• Published: 08/24/2006
• Est. Priority Date: 02/23/1998
• Status: Abandoned Application

• Current Assignee: David J. Corisis
• Original Assignee: David J. Corisis
• Inventors: Corisis, David J.
• Application Number:
  US11/406,147
• Publication Number:
  US 20060186533A1
• Time in Patent Office: Days
• US Class Current: 257/706
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2224/05026 the internal layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/06131 being uniform, i.e. having a uniform pitch across the array
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/812 Applying energy for connecting
• CPC Class Codes: H01L 2224/81201 Compression bonding
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/86 using tape automated bonding [TAB]
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49568 specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member that is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Semiconductor dice are bonded to the paddles by, e.g., conventional die attach methods, enabling bump attachment and testing to be conducted before detachment from the paddle frame strip.

Claims

1. A paddle frame strip providing a plurality of heat sinks, each heat sink connected to a surface of a semiconductor die, comprising:

an elongate metallic strip, comprising;

left and right rails;

a plurality of paddle frames positioned between said left and right rails;

wherein each said paddle frame includes a plurality of cross members joining said left and right rails, a generally centrally positioned paddle, and support bars supportably joining said paddle to said cross members and to said rails.

2. The paddle frame strip of claim 1, wherein said paddle frame strip is leadless.

3. The paddle frame strip of claim 1, wherein said paddle frame strip comprises at least one heat sink.

4. The paddle frame strip of claim 1, wherein said paddle has a suitable thickness for a heat sink.

5. The paddle frame strip of claim 1, wherein said paddle frame strip is formed of one of aluminum, silver, and alloys thereof.

6. A strip providing a plurality of heat sinks, each heat sink connected to a semiconductor die, comprising:

a strip, comprising;

left and right rails; and

a plurality of paddle frames positioned between the left and right rails, each paddle frame including a plurality of cross members joining said left and right rails, a generally centrally positioned paddle, and support bars supportably joining the paddle to the cross members and to the rails.

7. The strip of claim 6, wherein the strip includes no leades.

8. The strip of claim 6, wherein each paddle has a suitable thickness for a heat sink.

9. The strip of claim 6, wherein the strip comprises at least one of aluminum, silver, and alloys thereof.

10. A strip of heat sinks, each heat sink connected to a semiconductor die, comprising:

a strip, comprising;

left and right rails; and

a plurality of paddle frames positioned between the left and right rails, each paddle frame including a plurality of cross members joining said left and right rails, a generally centrally located paddle, and support bars joining the paddle to the cross members and to the rails.

11. The strip of claim 10, wherein the strip includes no leads.

12. The strip of claim 10, wherein each paddle has a suitable thickness for a heat sink.

13. The strip of claim 10, wherein the strip comprises at least one of aluminum, silver, and alloys thereof.