Heat dissipation device and heat dissipation method for electronic equipment

• US 20060187643A1
• Filed: 02/07/2006
• Published: 08/24/2006
• Est. Priority Date: 02/18/2005
• Status: Abandoned Application

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Tsurufusa, Hideo
• Application Number:
  US11/348,476
• Publication Number:
  US 20060187643A1
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: H05K 7/2049 Pressing means used to urge contact, e.g. springs

Abstract

According to one embodiment, fixing plates are formed to a shield case which covers a circuit board including a circuit component. When a heat sink, which has bent heat dissipation plates and can be accommodated in a shield case, is attached to the fixing plates and the surface of the circuit board is covered by the shield case, the heat sink comes into contact with the heat conduction sheet attached to the circuit component.

Claims

1. A heat dissipation device for electronic equipment, comprising:

a circuit board on which a circuit component is mounted;

a heat conduction sheet attached to the circuit component;

a shield case which covers the surface of the circuit board including the circuit component and has a flat plate which is approximately parallel to the surface of the circuit board and to which fixing plates which project from positions of the flat plate corresponding to the circuit component toward the circuit board are formed; and

a heat sink attached to the fixing plates of the shield case, coming into contact with the heat conduction sheet when the surface of the circuit board is covered by the shield case, and including bent heat dissipation plates to be accommodated in the shield case.

2. A heat dissipation device for electronic equipment according to claim 1, wherein the shield case forms the fixing plates by bending a part of the flat plate.

3. A heat dissipation device for electronic equipment according to claim 1, wherein a cutout portion is formed to the flat plate of the shield case to expose the heat sink attached to the fixing plates to the outside.

4. A heat dissipation device for electronic equipment according to claim 1, wherein the shield case includes a pair of fixing plates formed approximately parallel to each other,

the heat sink has side plates confronting the surfaces of the fixing plates, respectively;

and

the heat sink is attached to the shield case by engaging any ones of recessed portions and projecting portions formed to the respective side plates with the others of projecting portions and recessed portions formed to the respective fixing plates.

5. A heat dissipation device for electronic equipment according to claim 1, wherein the heat dissipation plates of the heat sink are bent in any shape of a triangular wave shape, a rectangular wave shape, a curved wave shape, and a rectangular shape.

6. A heat dissipation device for electronic equipment according to claim 1, wherein clearance holes are formed to the flat plate of the shield case in the portions where the heat dissipation plates are in the vicinities thereof.

7. A heat dissipation device for electronic equipment according to claim 1, wherein the heat sink has a base plate which comes into contact with the heat conduction sheet when the surface of the circuit board is covered by the shield case, and

the heat dissipation plates are a pair of heat dissipation plates formed integrally with the base plate and extending in an opposite direction with respect to the base plate.

8. A heat dissipation device for electronic equipment according to claim 7, wherein the pair of heat dissipation plates are formed in shapes that are symmetric across the base plate.

9. A heat dissipation device for electronic equipment according to claim 7, wherein the pair of heat dissipation plates are formed in shapes that are asymmetric across the base plate.

10. A heat dissipation device for electronic equipment comprising:

a circuit board formed in a flat shape;

a flat-shaped circuit component attached to the circuit board such that one surface of the circuit component confronts one surface of the circuit board;

a heat conduction sheet composed of a flexible material and attached to the surface of the circuit component opposite to the surface thereof confronting the circuit board;

a heat sink formed integrally of a base plate in contact with the heat conduction sheet, first side plates extending from ends of the base plate vertically with respect to the surface of the base plate, and heat dissipation plates extending from ends of the first side plates and bent in a predetermined shape; and

a shield case which accommodates the heat sink therein and covering the surface of the circuit board formed integrally of a flat plate disposed approximately parallel to the surface of the circuit board, second side plates extending from the peripheral edges of the flat plate, and fixing plates which project from predetermined positions of the flat plate in the same direction as the second side plates and to which the first side plates of the heat sink are attached.

11. A heat dissipation method for electronic equipment, comprising:

a first step of attaching a heat conduction sheet to a circuit component mounted on a circuit board;

a second step of attaching a heat sink having bent heat dissipation plates to fixing plates which project from positions of a flat plate of a shield case approximately parallel to the surface of the circuit board toward the circuit board, wherein the positions correspond to the circuit component, and the shield case covers the circuit board including the circuit component; and

a third step of covering the circuit board by the surface of the shield case such that the heat sink is accommodated in the shield case and comes into contact with the heat conduction sheet.