Arrangement and method for cooling a power semiconductor
First Claim
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1. An arrangement for cooling a power semiconductor, comprising:
- at least one power semiconductor and at least one passive electrical component;
at least one electrical terminal of the power semiconductor being thermally connected to an electrical terminal of the passive electrical component via an electrical connection; and
a cooling element thermally connected to at least a part of a surface of the passive electrical component or to the electrical connection.
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Abstract
In an arrangement and a method for cooling a power semiconductor in which at least one power semiconductor is electrically and thermally conductively connected to at least one passive electric component. Further, a cooling element is thermally conductively connected to at least a part of the surface of the passive electrical component and/or the electrically and thermally conductive connection.
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Citations
19 Claims
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1. An arrangement for cooling a power semiconductor, comprising:
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at least one power semiconductor and at least one passive electrical component;
at least one electrical terminal of the power semiconductor being thermally connected to an electrical terminal of the passive electrical component via an electrical connection; and
a cooling element thermally connected to at least a part of a surface of the passive electrical component or to the electrical connection. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for cooling a power semiconductor, comprising the steps of:
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transferring at least a part of a power loss generated in the power semiconductor as heat via an electrically and thermally conductive connection between at least one electrical terminal of the power semiconductor and an electrical terminal of a passive electrical component; and
dissipating at least part of the heat transferred to the passive electrical component with a cooling element thermally connected to the passive electrical component or to the electrically and thermally conductive connection.
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18. An arrangement for cooling a power semiconductor, comprising:
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at least one power semiconductor and at least one inductor arranged within 20 mm or less of the power semiconductor;
at least one electrical terminal of the power semiconductor being electrically and thermally connected to an electrical terminal of the inductor via an electrical connection; and
a cooling element thermally connected to the inductor.
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19. A method for cooling a power semiconductor, comprising the steps of:
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transferring at least a part of a power loss generated in the power semiconductor as heat via an electrically and thermally conductive connection between at least one electrical terminal of the power semiconductor and an electrical terminal of an inductor, the inductor being arranged within 20 mm or less of the power semiconductor; and
dissipating at least part of the heat transferred to the inductor with a cooling element thermally-connected to the inductor.
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Specification