Compound flow field board for fuel cell

• US 20060188770A1
• Filed: 02/23/2006
• Published: 08/24/2006
• Est. Priority Date: 02/24/2005
• Status: Abandoned Application

• Current Assignee: Antig Technology Co., Ltd.
• Original Assignee: Antig Technology Co., Ltd.
• Inventors: Huang, Wei-Li, Deng, Feng-Yi, Shu, Hsi-Ming
• Application Number:
  US11/359,595
• Publication Number:
  US 20060188770A1
• Time in Patent Office: Days
• US Class Current: 429/434
• CPC Class Codes: H01M 8/0204 Non-porous and characterised by the material
• CPC Class Codes: H01M 8/0228 in the form of layered or coated products
• CPC Class Codes: H01M 8/0247 characterised by the form characterised by a channel configuration H01M8/0258
• CPC Class Codes: H01M 8/0258 characterised by the configuration of channels, e.g. by the flow field of the reactant or coolant
• CPC Class Codes: H01M 8/0267 having heating or cooling means, e.g. heaters or coolant flow channels
• CPC Class Codes: H01M 8/0269 Separators, collectors or interconnectors including a printed circuit board
• CPC Class Codes: H01M 8/0271 Sealing or supporting means around electrodes, matrices or membranes
• CPC Class Codes: Y02E 60/50 Fuel cells

Abstract

A compound flow field board for a fuel cell comprises at least a first region and a second region. The first region includes a substrate made of a heat-conductive material, and is disposed corresponding to a membrane electrode assembly. The first region also comprises a projection protruded into the second region. The second region includes a substrate made of an adhesive material, and is connected with the first regions such that the compound flow field board becomes a one-piece structure.

Claims

1. A compound flow field board for a fuel cell, comprising:

at least a first region including a substrate made of a heat-conductive material, and is disposed corresponding to a membrane electrode assembly (MEA); and

a second region including a substrate made of an adhesive material, wherein the second region is connected with said first regions such that the compound flow field board becomes a one-piece structure;

wherein each said first region has a projection protruded into the second region.

2. The flow field board of claim 1, wherein the first region comprises a concave portion for containing a fuel.

3. The flow field board of claim 1, wherein the heat-conductive material is selected from a group consisting of aluminum, copper, aluminum alloy, copper alloy, stainless steel foil, golden foil, single metal, and metal alloy.

4. The flow field board of claim 1, wherein the second substrate material is a plastic substrate, a ceramic substrate, a printed circuit substrate, or a polymer plastic substrate.

5. The flow field board of claim 1, wherein the second region further comprises:

a fuel inlet disposed on a side of the second region; and

an injection flow channel disposed on the second region and connected to the fuel inlet.

6. The flow field board of claim 1, wherein the second region further comprises:

an outlet disposed on a side of the second region; and

an exhaust flow channel disposed on the second region and connected to the fuel outlet.

7. The flow field board of claim 2, wherein the fuel is a methanol solution.

8. The flow field board of claim 2, wherein the fuel is a liquid fuel.

9. The flow field board of claim 2, wherein the fuel is a gaseous fuel.

10. The flow field board of claim 2, wherein the fuel is an anode fuel.

11. The flow field board of claim 2, wherein the fuel is a cathode fuel.

12. The flow field board of claim 1, wherein a surface of the first region is treated by an acid-resisting process.

13. The flow field board of claim 1, wherein a surface of the first region is coated with Teflon.

14. The flow field board of claim 1, wherein the projection is exposed in air.

15. The flow field board of claim 1, wherein the projection is connected to a radiation component.

16. The flow field board of claim 1, wherein the projection is connected to a fuel tank.

17. The flow field board of claim 15, wherein the radiation component is a metal lamina, a heat-conductive tube, a heat-radiating flake, a heat sink, or a cooling device.

18. The flow field board of claim 1, wherein the compound flow field board is connected with a third substrate, so as to form a one-piece structure.

19. The flow field board of claim 1, further comprising a circuit layout disposed on a surface of the second region.