WIREBOND CRACK SENSOR FOR LOW-K DIE
First Claim
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1. A sensor structure for measuring damage encountered by a semiconductor device, wherein said sensor structure comprises:
- at least one wirebond sensor including circuitry for determining damage in a low-k die, wafer or pad, said circuitry wirebonding serpentine and comb-like wiring in a dielectric substrate.
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Abstract
A sensor for measuring cracks in a semiconductor device, such as a wafer and, more particularly, to a BEOL wirebond crack sensor for low-k dies or wafers, and a method of providing the wirebond crack sensor for low-k wafers or the like structures.
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Citations
18 Claims
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1. A sensor structure for measuring damage encountered by a semiconductor device, wherein said sensor structure comprises:
at least one wirebond sensor including circuitry for determining damage in a low-k die, wafer or pad, said circuitry wirebonding serpentine and comb-like wiring in a dielectric substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of providing a sensor structure for measuring damage encountered by a semiconductor device, wherein said method comprises:
providing at least one wirebond sensor including circuitry for determining damage in a low-k die, wafer or pad, said circuitry wirebonding serpentine and comb-like wiring in a dielectric substrate. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
Specification